发明授权
- 专利标题： Interposer test structures and methods
- 专利标题（中）： 内插测试结构和方法
-
申请号： US13198223申请日： 2011-08-04
-
公开(公告)号： US09128123B2公开(公告)日： 2015-09-08
- 发明人: Tzuan-Horng Liu , Chen-Hua Yu , Hsien-Pin Hu , Tzu-Yu Wang , Wei-Cheng Wu , Shang-Yun Hou , Shin-Puu Jeng
- 申请人： Tzuan-Horng Liu , Chen-Hua Yu , Hsien-Pin Hu , Tzu-Yu Wang , Wei-Cheng Wu , Shang-Yun Hou , Shin-Puu Jeng
- 申请人地址： TW Hsin-Chu
- 专利权人： Taiwan Semiconductor Manufacturing Company, Ltd.
- 当前专利权人： Taiwan Semiconductor Manufacturing Company, Ltd.
- 当前专利权人地址： TW Hsin-Chu
- 代理机构： Slater & Matsil, L.L.P.
- 主分类号： H01L23/528
- IPC分类号： H01L23/528 ; G01R1/073 ; H01L21/66 ; H01L21/56 ; H01L21/683 ; H01L23/498
摘要：
An embodiment of the disclosure is a structure comprising an interposer. The interposer has a test structure extending along a periphery of the interposer, and at least a portion of the test structure is in a first redistribution element. The first redistribution element is on a first surface of a substrate of the interposer. The test structure is intermediate and electrically coupled to at least two probe pads.
公开/授权文献
- US20120305916A1 Interposer Test Structures and Methods 公开/授权日：2012-12-06