发明授权
US09129817B2 Magnetic core inductor (MCI) structures for integrated voltage regulators
有权
用于集成稳压器的磁芯电感(MCI)结构
- 专利标题: Magnetic core inductor (MCI) structures for integrated voltage regulators
- 专利标题(中): 用于集成稳压器的磁芯电感(MCI)结构
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申请号: US13801623申请日: 2013-03-13
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公开(公告)号: US09129817B2公开(公告)日: 2015-09-08
- 发明人: Adel A. Elsherbini , Kevin P. O'Brien , Henning Braunisch , Krishna Bharath
- 申请人: Adel A. Elsherbini , Kevin P. O'Brien , Henning Braunisch , Krishna Bharath
- 申请人地址: US CA Santa Clara
- 专利权人: Intel Corporation
- 当前专利权人: Intel Corporation
- 当前专利权人地址: US CA Santa Clara
- 代理机构: Blakely, Sokoloff, Taylor & Zafman LLP
- 主分类号: H01L27/08
- IPC分类号: H01L27/08 ; H01L27/06 ; H01L23/64 ; H01L25/16 ; H01L27/01 ; H01L49/02
摘要:
Semiconductor packages including magnetic core inductor (MCI) structures for integrated voltage regulators are described. In an example, a semiconductor package includes a package substrate and a semiconductor die coupled to a first surface of the package substrate. The semiconductor die has a first plurality of metal-insulator-metal (MIM) capacitor layers thereon. The semiconductor package also includes a magnetic core inductor (MCI) die coupled to a second surface of the package substrate. The MCI die includes one or more slotted inductors and has a second plurality of MIM capacitor layers thereon.