Invention Grant
- Patent Title: Microelectronic devices and microelectronic support devices, and associated assemblies and methods
- Patent Title (中): 微电子器件和微电子支持器件，以及相关组件和方法
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Application No.: US14331722Application Date: 2014-07-15
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Publication No.: US09129862B2Publication Date: 2015-09-08
- Inventor: Teck Kheng Lee , David Yih Ming Chai , Hong Wan Ng
- Applicant: Micron Technology, Inc.
- Applicant Address: US ID Boise
- Assignee: Micron Technology, Inc.
- Current Assignee: Micron Technology, Inc.
- Current Assignee Address: US ID Boise
- Agency: Perkins Coie LLP
- Priority: SG200505410 20050824
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H01L23/02 ; H01L23/12 ; H01L21/768 ; H01L23/13 ; H01L23/31 ; H01L23/48 ; H01L23/00
Abstract:
Microelectronic devices, associated assemblies, and associated methods are disclosed herein. For example, certain aspects of the invention are directed toward a microelectronic device that includes a microfeature workpiece having a side and an aperture in the side. The device can further include a workpiece contact having a surface. At least a portion of the surface of the workpiece contact can be accessible through the aperture and through a passageway extending between the aperture and the surface. Other aspects of the invention are directed toward a microelectronic support device that includes a support member having a side carrying a support contact that can be connectable to a workpiece contact of a microfeature workpiece. The device can further include recessed support contact means carried by the support member. The recessed support contact means can be connectable to a second workpiece contact of the microfeature workpiece.
Public/Granted literature
- US20140326488A1 MICROELECTRONIC DEVICES AND MICROELECTRONIC SUPPORT DEVICES, AND ASSOCIATED ASSEMBLIES AND METHODS Public/Granted day:2014-11-06
Information query
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