Invention Grant
- Patent Title: RF calibration through-chip inductive coupling
- Patent Title (中): RF校准片上感应耦合
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Application No.: US13419911Application Date: 2012-03-14
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Publication No.: US09129940B2Publication Date: 2015-09-08
- Inventor: Hsieh-Hung Hsieh , Yi-Hsuan Liu , Tzu-Jin Yeh , Chewn-Pu Jou , Fu-Lung Hsueh
- Applicant: Hsieh-Hung Hsieh , Yi-Hsuan Liu , Tzu-Jin Yeh , Chewn-Pu Jou , Fu-Lung Hsueh
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Duane Morris LLP
- Main IPC: G01R35/00
- IPC: G01R35/00 ; H01L23/48 ; H01L23/66 ; H01L25/065 ; H04B5/00

Abstract:
An integrated circuit includes a first chip and a second chip coupled to the first chip in a vertical stack. The first chip includes a radio frequency circuit and a first coil electrically coupled to the radio frequency circuit. The second chip includes a calibration circuit and a second coil electrically coupled to the calibration circuit. The calibration circuit is configured to calibrate the radio frequency circuit disposed on the first chip through inductive coupling between the first and second coils.
Public/Granted literature
- US20130241634A1 RF CALIBRATION THROUGH-CHIP INDUCTIVE COUPLING Public/Granted day:2013-09-19
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