发明授权
- 专利标题： Treatment device, treatment method, and surface treatment jig
- 专利标题（中）： 处理装置，处理方法和表面处理夹具
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申请号： US12514193申请日： 2007-10-12
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公开(公告)号： US09129999B2公开(公告)日： 2015-09-08
- 发明人: Yasumasa Iwata , Akihiko Nakamura
- 申请人： Yasumasa Iwata , Akihiko Nakamura
- 申请人地址： JP Kanagawa
- 专利权人： Tokyo Ohka Kogyo Co., Ltd.
- 当前专利权人： Tokyo Ohka Kogyo Co., Ltd.
- 当前专利权人地址： JP Kanagawa
- 代理机构： Renner, Otto, Boisselle & Sklar, LLP
- 优先权： JP2006-324433 20061130
- 国际申请： PCT/JP2007/069961 WO 20071012
- 国际公布： WO2008/065820 WO 20080605
- 主分类号： B08B3/04
- IPC分类号： B08B3/04 ; H01L21/67 ; H01L21/02
摘要：
The treatment device 100 of the present invention is a treatment device for carrying out treatment to a treatment object 18 whose treatment surface includes a second treatment surface 18b and a first treatment surface 18a surrounding the second treatment surface 18b, the treatment device including: a table section 10 for placing the treatment object 18 thereon; and a first feeding section 24 for feeding a first treatment liquid to an approximate boundary between the first and the second treatment surfaces 18a, 18b and a second feeding section 46 for feeding a second treatment liquid to the second treatment surface 18b. Thus, the present invention provides a treatment device, a treatment method, and a surface treatment jig, each of the treatment device and the treatment method being capable of carrying out independent treatments to a treatment surface and an exposed surface surrounding the treatment surface, respectively.
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