Invention Grant
US09134367B2 Sensing structure of alignment of a probe for testing integrated circuits
有权
用于测试集成电路的探头对准的感应结构
- Patent Title: Sensing structure of alignment of a probe for testing integrated circuits
- Patent Title (中): 用于测试集成电路的探头对准的感应结构
-
Application No.: US13155623Application Date: 2011-06-08
-
Publication No.: US09134367B2Publication Date: 2015-09-15
- Inventor: Alberto Pagani
- Applicant: Alberto Pagani
- Applicant Address: IT Agrate Brianza (MB)
- Assignee: STMicroelectronics S.r.l.
- Current Assignee: STMicroelectronics S.r.l.
- Current Assignee Address: IT Agrate Brianza (MB)
- Agency: Gardere Wynee Sewell LLP
- Priority: ITVI2010A0159 20100610
- Main IPC: G01R31/00
- IPC: G01R31/00 ; G01R31/28 ; C12Q1/00 ; G01R1/067 ; H01L21/66
Abstract:
A sensing structure for use in testing integrated circuits on a substrate. The sensing structure includes at least two sensing regions connectable to a probe and at least one first sensing element. Each of the at least one first sensing elements is directly connected to two sensing regions such that for each sensing region a different value of an electrical parameter is measurable between the sensing region and a first reference potential so as to reliably determine a drift direction of a probe.
Public/Granted literature
- US20120068725A1 SENSING STRUCTURE OF ALIGNMENT OF A PROBE FOR TESTING INTEGRATED CIRCUITS Public/Granted day:2012-03-22
Information query
