发明授权
US09134777B2 Bi-modal power delivery scheme for an integrated circuit comprising multiple functional blocks on a single die to achieve desired average throughput for the integrated circuit
有权
一种用于集成电路的双模式功率输送方案，其包括在单个管芯上的多个功能块，以实现集成电路的期望的平均吞吐量
- 专利标题： Bi-modal power delivery scheme for an integrated circuit comprising multiple functional blocks on a single die to achieve desired average throughput for the integrated circuit
- 专利标题（中）： 一种用于集成电路的双模式功率输送方案，其包括在单个管芯上的多个功能块，以实现集成电路的期望的平均吞吐量
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申请号： US13489859申请日： 2012-06-06
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公开(公告)号： US09134777B2公开(公告)日： 2015-09-15
- 发明人: Yeshwant Nagaraj Kolla , Jeffrey Herbert Fischer , William R. Flederbach
- 申请人： Yeshwant Nagaraj Kolla , Jeffrey Herbert Fischer , William R. Flederbach
- 申请人地址： US CA San Diego
- 专利权人： QUALCOMM Incorporated
- 当前专利权人： QUALCOMM Incorporated
- 当前专利权人地址： US CA San Diego
- 代理商 Peter Michael Kamarchik; Nicholas J. Pauley; Paul Holdaway
- 主分类号： G06F1/00
- IPC分类号： G06F1/00 ; G06F1/26 ; G06F1/32
摘要：
Systems and methods for bi-modal and fine grained power delivery to an integrated circuit comprising functional blocks. A first power source is coupled to a functional block of the integrated circuit for supporting a first operating mode of the functional block. A second power source is coupled to the functional block for supporting a second operating mode of the functional block. The first and second operating modes can be high and low frequency modes respectively. The second power source can be derived from the first power source using on-die regulators or provided independently. A desired average throughput of the functional block can be achieved by controlling duty cycles of the first and second power sources.
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