发明授权
US09136343B2 Deep gate-all-around semiconductor device having germanium or group III-V active layer
有权
具有锗或III-V族有源层的深栅极全面半导体器件
- 专利标题: Deep gate-all-around semiconductor device having germanium or group III-V active layer
- 专利标题(中): 具有锗或III-V族有源层的深栅极全面半导体器件
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申请号: US13749139申请日: 2013-01-24
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公开(公告)号: US09136343B2公开(公告)日: 2015-09-15
- 发明人: Ravi Pillarisetty , Willy Rachmady , Van H. Le , Seung Hoon Sung , Jessica S. Kachian , Jack T. Kavalieros , Han Wui Then , Gilbert Dewey , Marko Radosavljevic , Benjamin Chu-Kung , Niloy Mukherjee
- 申请人: Ravi Pillarisetty , Willy Rachmady , Van H. Le , Seung Hoon Sung , Jessica S. Kachian , Jack T. Kavalieros , Han Wui Then , Gilbert Dewey , Marko Radosavljevic , Benjamin Chu-Kung , Niloy Mukherjee
- 申请人地址: US CA Santa Clara
- 专利权人: Intel Corporation
- 当前专利权人: Intel Corporation
- 当前专利权人地址: US CA Santa Clara
- 代理机构: Blakely, Sokoloff, Taylor & Zafman LLP
- 主分类号: H01L29/66
- IPC分类号: H01L29/66 ; H01L29/423 ; H01L29/78 ; H01L29/786
摘要:
Deep gate-all-around semiconductor devices having germanium or group III-V active layers are described. For example, a non-planar semiconductor device includes a hetero-structure disposed above a substrate. The hetero-structure includes a hetero-junction between an upper layer and a lower layer of differing composition. An active layer is disposed above the hetero-structure and has a composition different from the upper and lower layers of the hetero-structure. A gate electrode stack is disposed on and completely surrounds a channel region of the active layer, and is disposed in a trench in the upper layer and at least partially in the lower layer of the hetero-structure. Source and drain regions are disposed in the active layer and in the upper layer, but not in the lower layer, on either side of the gate electrode stack.
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