Invention Grant
- Patent Title: Three-dimensional microstructures
- Patent Title (中): 三维微结构
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Application No.: US14253061Application Date: 2014-04-15
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Publication No.: US09136575B2Publication Date: 2015-09-15
- Inventor: David Sherrer , Jean-Marc Rollin , Kenneth Vanhille , Marcus Oliver , Steven E. Huettner
- Applicant: Nuvotronics, LLC
- Applicant Address: US VA Radford
- Assignee: NUVOTRONICS, LLC
- Current Assignee: NUVOTRONICS, LLC
- Current Assignee Address: US VA Radford
- Agency: Dann Dorfman Herrell & Skillman, PC
- Agent Niels Haun
- Main IPC: H01P5/12
- IPC: H01P5/12 ; H01P3/06 ; H01P5/18

Abstract:
An apparatus comprising a first power combiner/divider network and a second power combiner/divider network. The first power combiner/divider network splits a first electromagnetic signal into split signals that are connectable to signal processor(s). The second power combiner/divider network combines processed signals into a second electromagnetic signal. The apparatus includes a three-dimensional coaxial microstructure.
Public/Granted literature
- US20140218131A1 THREE-DIMENSIONAL MICROSTRUCTURES Public/Granted day:2014-08-07
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