Invention Grant
US09137898B2 Method of manufacturing a printed circuit board including a component located in a via
有权
制造包括位于通孔中的部件的印刷电路板的方法
- Patent Title: Method of manufacturing a printed circuit board including a component located in a via
- Patent Title (中): 制造包括位于通孔中的部件的印刷电路板的方法
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Application No.: US13243251Application Date: 2011-09-23
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Publication No.: US09137898B2Publication Date: 2015-09-15
- Inventor: Gary D. Frasco
- Applicant: Gary D. Frasco
- Applicant Address: CA Montreal
- Assignee: Dialogic Corporation
- Current Assignee: Dialogic Corporation
- Current Assignee Address: CA Montreal
- Agency: Chapin IP Law, LLC
- Main IPC: H05K3/30
- IPC: H05K3/30 ; H05K1/18 ; H05K3/34 ; H05K3/40
Abstract:
A press fit passive component, such as a resistor or capacitor, adapted to fit within, or partially within, a via of a printed circuit board. In one example, the press fit passive component has a cylindrically shaped body with solderable terminals at either end of the body, and a dielectric collar disposed at least partially about the cylindrically shaped body. The component is placed in the via and soldered in order to provide a mechanical and electrical connection to the printed circuit board.
Public/Granted literature
- US20120005892A1 METHOD OF MANUFACTURING A PRINTED CIRCUIT BOARD INCLUDING A COMPONENT LOCATED IN A VIA Public/Granted day:2012-01-12
Information query
