公开(公告)号：US07891980B2

公开(公告)日：2011-02-22

申请号：US12265311

申请日：2008-11-05

Applicant: Gary D. Frasco

Inventor： Gary D. Frasco

IPC: H01R12/00

CPC classification number: H01R12/52 ,  H05K1/023 ,  H05K1/0231 ,  H05K1/0233 ,  H05K1/0246 ,  H05K1/141 ,  H05K1/181 ,  H05K1/184 ,  H05K3/4046 ,  H05K2201/10022 ,  H05K2201/10037 ,  H05K2201/10174 ,  H05K2201/10181 ,  H05K2201/10265 ,  H05K2201/10378 ,  H05K2201/10734 ,  Y02P70/611

Abstract: An interconnect device is provided with a body through which a plurality of wells has been defined. At least one component having two terminals is provided in one or more of the wells. The component is sealed in its respective well such that the two terminals are accessible on opposite sides of the body. The body corresponds to a Ball Grid Array (BGA) device and is positioned between a BGA device and a printed circuit board (PCB). The component in the well is then inline with a solder ball on the BGA device and a corresponding pad on the PCB. Providing the component in the well frees up surface area on the PCB and also allows for positioning the component closer to a source of a signal. A component in the well is a discrete component having two terminals that may be solderable or made from a conductive pliable material. The terminals may be spring-mounted on the component.

Abstract translation: 互连装置设置有已经定义了多个井的主体。 在一个或多个井中提供具有两个端子的至少一个部件。 该部件密封在其各自的井中，使得两个端子可在主体的相对侧上接近。 主体对应于球栅阵列（BGA）器件，并位于BGA器件和印刷电路板（PCB）之间。 然后，井中的组件与BGA设备上的焊球和PCB上的相应焊盘成直线。 提供井中的组件释放PCB上的表面积，并且还允许将组件定位成更靠近信号源。 井中的部件是具有两个端子的分立部件，该端子可以是可焊接的或由导电柔性材料制成。 端子可以弹簧安装在部件上。

公开(公告)号：US20090175012A1

公开(公告)日：2009-07-09

申请号：US11969401

申请日：2008-01-04

Applicant: Gary D. Frasco

Inventor： Gary D. Frasco

IPC: H05K1/18 ,  H05K3/34

CPC classification number: H05K1/184 ,  H05K3/3442 ,  H05K3/4046 ,  H05K2201/10583 ,  H05K2201/1059 ,  H05K2201/10636 ,  Y02P70/611 ,  Y10T29/49139

Abstract: A press fit passive component, such as a resistor or capacitor, adapted to fit within, or partially within, a via of a printed circuit board. In one example, the press fit passive component has a cylindrically shaped body with solderable terminals at either end of the body, and a dielectric collar disposed at least partially about the cylindrically shaped body.

Abstract translation: 压配合的无源部件，例如电阻器或电容器，适于装配在印刷电路板的通孔内或部分位于印刷电路板的通孔内。 在一个示例中，压配合无源部件具有在本体的任一端具有可焊接端子的圆柱形体，以及至少部分地围绕圆柱形主体设置的介电轴颈。

公开(公告)号：US09137898B2

公开(公告)日：2015-09-15

申请号：US13243251

申请日：2011-09-23

Applicant: Gary D. Frasco

Inventor： Gary D. Frasco

IPC: H05K3/30 ,  H05K1/18 ,  H05K3/34 ,  H05K3/40

CPC classification number: H05K1/184 ,  H05K3/3442 ,  H05K3/4046 ,  H05K2201/10583 ,  H05K2201/1059 ,  H05K2201/10636 ,  Y02P70/611 ,  Y10T29/49139

Abstract: A press fit passive component, such as a resistor or capacitor, adapted to fit within, or partially within, a via of a printed circuit board. In one example, the press fit passive component has a cylindrically shaped body with solderable terminals at either end of the body, and a dielectric collar disposed at least partially about the cylindrically shaped body. The component is placed in the via and soldered in order to provide a mechanical and electrical connection to the printed circuit board.

Abstract translation: 压配合的无源部件，例如电阻器或电容器，适于装配在印刷电路板的通孔内或部分位于印刷电路板的通孔内。 在一个示例中，压配合无源部件具有在本体的任一端具有可焊接端子的圆柱形体，以及至少部分地围绕圆柱形主体设置的介电轴颈。 将部件放置在通孔中并进行焊接，以便提供与印刷电路板的机械和电连接。

公开(公告)号：US20120005892A1

公开(公告)日：2012-01-12

申请号：US13243251

申请日：2011-09-23

Applicant: Gary D. Frasco

Inventor： Gary D. Frasco

IPC: H05K3/30

CPC classification number: H05K1/184 ,  H05K3/3442 ,  H05K3/4046 ,  H05K2201/10583 ,  H05K2201/1059 ,  H05K2201/10636 ,  Y02P70/611 ,  Y10T29/49139

Abstract: A press fit passive component, such as a resistor or capacitor, adapted to fit within, or partially within, a via of a printed circuit board. In one example, the press fit passive component has a cylindrically shaped body with solderable terminals at either end of the body, and a dielectric collar disposed at least partially about the cylindrically shaped body. The component is placed in the via and soldered in order to provide a mechanical and electrical connection to the printed circuit board.

Abstract translation: 压配合的无源部件，例如电阻器或电容器，适于装配在印刷电路板的通孔内或部分位于印刷电路板的通孔内。 在一个示例中，压配合无源部件具有在本体的任一端具有可焊接端子的圆柱形体，以及至少部分地围绕圆柱形主体设置的介电轴颈。 将部件放置在通孔中并进行焊接，以便提供与印刷电路板的机械和电连接。

公开(公告)号：US20100112826A1

公开(公告)日：2010-05-06

申请号：US12265311

申请日：2008-11-05

Applicant: Gary D. Frasco

Inventor： Gary D. Frasco

IPC: H01R12/00

CPC classification number: H01R12/52 ,  H05K1/023 ,  H05K1/0231 ,  H05K1/0233 ,  H05K1/0246 ,  H05K1/141 ,  H05K1/181 ,  H05K1/184 ,  H05K3/4046 ,  H05K2201/10022 ,  H05K2201/10037 ,  H05K2201/10174 ,  H05K2201/10181 ,  H05K2201/10265 ,  H05K2201/10378 ,  H05K2201/10734 ,  Y02P70/611

Abstract: An interconnect device is provided with a body through which a plurality of wells has been defined. At least one component having two terminals is provided in one or more of the wells. The component is sealed in its respective well such that the two terminals are accessible on opposite sides of the body. The body corresponds to a Ball Grid Array (BGA) device and is positioned between a BGA device and a printed circuit board (PCB). The component in the well is then inline with a solder ball on the BGA device and a corresponding pad on the PCB. Providing the component in the well frees up surface area on the PCB and also allows for positioning the component closer to a source of a signal. A component in the well is a discrete component having two terminals that may be solderable or made from a conductive pliable material. The terminals may be spring-mounted on the component.

Abstract translation: 互连装置设置有已经定义了多个井的主体。 在一个或多个井中提供具有两个端子的至少一个部件。 该部件密封在其各自的井中，使得两个端子可在主体的相对侧上接近。 主体对应于球栅阵列（BGA）器件，并位于BGA器件和印刷电路板（PCB）之间。 然后，井中的组件与BGA设备上的焊球和PCB上的相应焊盘成直线。 提供井中的组件释放PCB上的表面积，并且还允许将组件定位成更靠近信号源。 井中的部件是具有两个端子的分立部件，该端子可以是可焊接的或由导电柔性材料制成。 端子可以弹簧安装在部件上。