Invention Grant
US09139900B2 Indium target and manufacturing method thereof 有权
铟靶及其制造方法

Indium target and manufacturing method thereof
Abstract:
The present invention provides an indium target and manufacturing method thereof, where deposition rate is high, initial discharge voltage is low, and deposition rate and discharge voltage, from the start of sputtering to the end of sputtering, are stable. In the indium target, an aspect ratio (length of longer direction/length of shorter direction) of crystal particle, observed from cross-section direction of the target, is 2.0 or less.
Public/Granted literature
Information query
Patent Agency Ranking
0/0