Invention Grant
- Patent Title: Indium target and manufacturing method thereof
- Patent Title (中): 铟靶及其制造方法
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Application No.: US13504329Application Date: 2011-07-07
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Publication No.: US09139900B2Publication Date: 2015-09-22
- Inventor: Yousuke Endo , Masaru Sakamoto
- Applicant: Yousuke Endo , Masaru Sakamoto
- Applicant Address: JP Tokyo
- Assignee: JX Nippon Mining Metals Corporation
- Current Assignee: JX Nippon Mining Metals Corporation
- Current Assignee Address: JP Tokyo
- Agency: Nields, Lemack & Frame, LLC
- Priority: JP2011-043954 20110301
- International Application: PCT/JP2011/065585 WO 20110707
- International Announcement: WO2012/117579 WO 20120907
- Main IPC: C23C14/00
- IPC: C23C14/00 ; C23C14/34 ; H01J37/34

Abstract:
The present invention provides an indium target and manufacturing method thereof, where deposition rate is high, initial discharge voltage is low, and deposition rate and discharge voltage, from the start of sputtering to the end of sputtering, are stable. In the indium target, an aspect ratio (length of longer direction/length of shorter direction) of crystal particle, observed from cross-section direction of the target, is 2.0 or less.
Public/Granted literature
- US20130037408A1 Indium Target And Manufacturing Method Thereof Public/Granted day:2013-02-14
Information query
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