Invention Grant
- Patent Title: Integration of current measurement in wiring structure of an electronic circuit
- Patent Title (中): 电流测量在电子电路布线结构中的集成
-
Application No.: US13886285Application Date: 2013-05-03
-
Publication No.: US09140735B2Publication Date: 2015-09-22
- Inventor: Martin Gruber , Angela Kessler
- Applicant: Infineon Technologies AG
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neubiberg
- Main IPC: G01R27/08
- IPC: G01R27/08 ; G01R27/14 ; G01R31/26 ; G01R15/18 ; G01R31/28 ; G01R3/00 ; G01R1/20 ; H05K1/16 ; G01R13/34 ; H05K3/06

Abstract:
A method of manufacturing an electronic circuit with an integrally formed capability of providing information indicative of a value of a current flowing in the electronic circuit, wherein the method comprises forming an electrically conductive wiring structure on a substrate, configuring a first section of the wiring structure for contributing to a predefined use function of the electronic circuit, and configuring a second section of the wiring structure for providing information indicative of the value of the current flowing in the electronic circuit upon applying a stimulus signal to the second section, wherein at least a part of the configuring of the first section and the configuring of the second section is performed simultaneously.
Public/Granted literature
- US20140327458A1 Integration of current measurement in wiring structure of an electronic circuit Public/Granted day:2014-11-06
Information query