Invention Grant
- Patent Title: Using spectra to determine polishing endpoints
- Patent Title (中): 使用光谱确定抛光终点
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Application No.: US14041113Application Date: 2013-09-30
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Publication No.: US09142466B2Publication Date: 2015-09-22
- Inventor: Harry Q. Lee , Boguslaw A. Swedek , Dominic J. Benvegnu , Jeffrey Drue David
- Applicant: Applied Materials, Inc.
- Applicant Address: US CA Santa Clara
- Assignee: Applied Materials, Inc.
- Current Assignee: Applied Materials, Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: Fish & Richardson P.C.
- Main IPC: H01L21/302
- IPC: H01L21/302 ; H01L21/461 ; B44C1/22 ; C03C15/00 ; C03C25/68 ; G06F19/00 ; H01L21/66 ; B24B37/013 ; B24B49/12 ; H01L21/306
Abstract:
Methods of determining a polishing endpoint are described using spectra obtained during a polishing sequence. In particular, techniques for using only desired spectra, faster searching methods and more robust rate determination methods are described.
Public/Granted literature
- US20140045282A1 Using Spectra to Determine Polishing Endpoints Public/Granted day:2014-02-13
Information query
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