Invention Grant
US09142679B2 Method for manufacturing semiconductor device using oxide semiconductor
有权
使用氧化物半导体的半导体器件的制造方法
- Patent Title: Method for manufacturing semiconductor device using oxide semiconductor
- Patent Title (中): 使用氧化物半导体的半导体器件的制造方法
-
Application No.: US13686281Application Date: 2012-11-27
-
Publication No.: US09142679B2Publication Date: 2015-09-22
- Inventor: Shunpei Yamazaki , Atsuo Isobe , Yoshinori Ieda , Masaharu Nagai
- Applicant: Semiconductor Energy Laboratory Co., Ltd.
- Applicant Address: JP Atsugi-shi, Kanagawa-ken
- Assignee: Semiconductor Energy Laboratory Co., Ltd.
- Current Assignee: Semiconductor Energy Laboratory Co., Ltd.
- Current Assignee Address: JP Atsugi-shi, Kanagawa-ken
- Agency: Robinson Intellectual Property Law Office, P.C.
- Agent Eric J. Robinson
- Priority: JP2011-264973 20111202; JP2011-265036 20111202; JP2011-265158 20111202; JP2011-283789 20111226
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H01L29/786 ; H01L29/66

Abstract:
A semiconductor device including a minute transistor with a short channel length is provided. A gate insulating layer is formed over a gate electrode layer; an oxide semiconductor layer is formed over the gate insulating layer; a first conductive layer and a second conductive layer are formed over the oxide semiconductor layer; a conductive film is formed over the first conductive layer and the second conductive layer; a resist mask is formed over the conductive film by performing electron beam exposure; and then a third conductive layer and a fourth conductive layer are formed over and in contact with the first conductive layer and the second conductive layer, respectively, by selectively etching the conductive film.
Public/Granted literature
- US20130140554A1 SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME Public/Granted day:2013-06-06
Information query
IPC分类: