Invention Grant
- Patent Title: Sensor-integrated chip for CCD camera
- Patent Title (中): 用于CCD摄像头的传感器集成芯片
-
Application No.: US14113032Application Date: 2012-04-21
-
Publication No.: US09143710B2Publication Date: 2015-09-22
- Inventor: Jung Won Lee , Seok Yong Hong , Jeong Ho Lim
- Applicant: Jung Won Lee , Seok Yong Hong , Jeong Ho Lim
- Applicant Address: KR
- Assignee: SEMISOLUTION CO., LTD.
- Current Assignee: SEMISOLUTION CO., LTD.
- Current Assignee Address: KR
- Agency: Cantor Colburn LLP
- Priority: KR10-2011-0037931 20110422
- International Application: PCT/KR2012/003100 WO 20120421
- International Announcement: WO2012/144869 WO 20121026
- Main IPC: H04N5/335
- IPC: H04N5/335 ; H04N5/225 ; H04N5/372 ; H01L27/146
Abstract:
The present invention relates to a sensor-integrated chip for a CCD camera in which a CCD sensor, an H/V driver for driving the CCD sensor, and an ISP (Image Signal Process) chip, which inputs a control signal for driving the CCD sensor to the H/V driver and allows a video to be displayed on a monitor (not shown) in response to an output signal from the CCD sensor, are stacked and connected with each other by inter-pad wire bonding into one IC package to be one chip, by an SIP (system In Package) method.
Public/Granted literature
- US20140043513A1 SENSOR-INTEGRATED CHIP FOR CCD CAMERA Public/Granted day:2014-02-13
Information query
