发明授权
- 专利标题： Packages for multiple semiconductor chips
- 专利标题（中）： 多个半导体芯片的封装
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申请号： US13733761申请日： 2013-01-03
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公开(公告)号： US09147600B2公开(公告)日： 2015-09-29
- 发明人: Tyrone Jon Donato Soller
- 申请人： Infineon Technologies AG
- 申请人地址： DE Neubiberg
- 专利权人： Infineon Technologies AG
- 当前专利权人： Infineon Technologies AG
- 当前专利权人地址： DE Neubiberg
- 代理机构： Slater & Matsil, L.L.P.
- 主分类号： H01L23/495
- IPC分类号： H01L23/495 ; H01L23/34 ; H01L23/04 ; H01L23/02 ; H01L23/48 ; H01L23/52 ; H01L29/40 ; H01L21/768 ; H01L23/00 ; H01L23/13 ; H01L23/367 ; H01L23/498 ; H01L25/065 ; H01L21/56 ; H01L23/31 ; H01L25/16
摘要：
In accordance with an embodiment of the present invention, a semiconductor device has a substrate having a first surface and a second surface opposite the first surface. Also, the substrate has a first hole. A plurality of leads is disposed over the first surface of the substrate and a die paddle is disposed in the first hole. Additionally, an encapsulant is disposed on the die paddle and the plurality of leads.
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