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公开(公告)号：US09698086B2
公开(公告)日：2017-07-04
申请号：US14306243
申请日：2014-06-17
IPC分类号： H01L23/495 , H01L25/00 , H01L23/36 , H01L23/433 , H01L23/31 , H01L23/00
CPC分类号： H01L23/49568 , H01L23/3107 , H01L23/4334 , H01L23/49575 , H01L24/40 , H01L24/45 , H01L24/48 , H01L24/49 , H01L25/50 , H01L2224/16245 , H01L2224/32145 , H01L2224/32245 , H01L2224/40245 , H01L2224/40247 , H01L2224/45124 , H01L2224/45139 , H01L2224/45144 , H01L2224/45147 , H01L2224/45565 , H01L2224/48091 , H01L2224/48105 , H01L2224/48247 , H01L2224/48465 , H01L2224/4848 , H01L2224/49113 , H01L2224/73221 , H01L2224/73253 , H01L2224/84801 , H01L2224/8485 , H01L2224/85207 , H01L2224/85214 , H01L2224/85801 , H01L2224/92247 , H01L2924/00014 , H01L2924/014 , H01L2924/12032 , H01L2924/12042 , H01L2924/1301 , H01L2924/13034 , H01L2924/1305 , H01L2924/1306 , H01L2924/13091 , H01L2924/181 , H01L2224/45664 , H01L2924/00 , H01L2924/00012 , H01L2224/37099
摘要： Embodiments provide provides a chip package. The chip package may include a leadframe having a die pad and a plurality of lead fingers; a first chip attached to the die pad, the first chip being bonded to one or more of the lead fingers via a first set of wire bonds; a second chip bonded to one or more of the lead fingers via flip chip; and a heat slug attached to the second chip.
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公开(公告)号：US09147600B2
公开(公告)日：2015-09-29
申请号：US13733761
申请日：2013-01-03
IPC分类号： H01L23/495 , H01L23/34 , H01L23/04 , H01L23/02 , H01L23/48 , H01L23/52 , H01L29/40 , H01L21/768 , H01L23/00 , H01L23/13 , H01L23/367 , H01L23/498 , H01L25/065 , H01L21/56 , H01L23/31 , H01L25/16
CPC分类号： H01L21/768 , H01L21/561 , H01L23/13 , H01L23/3128 , H01L23/3135 , H01L23/3675 , H01L23/49861 , H01L24/97 , H01L25/0652 , H01L25/16 , H01L2224/05554 , H01L2224/48091 , H01L2224/48227 , H01L2224/48471 , H01L2224/49171 , H01L2224/49175 , H01L2924/07802 , H01L2924/13034 , H01L2924/1305 , H01L2924/13091 , H01L2924/15787 , H01L2924/16195 , H01L2924/181 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： In accordance with an embodiment of the present invention, a semiconductor device has a substrate having a first surface and a second surface opposite the first surface. Also, the substrate has a first hole. A plurality of leads is disposed over the first surface of the substrate and a die paddle is disposed in the first hole. Additionally, an encapsulant is disposed on the die paddle and the plurality of leads.
摘要翻译： 根据本发明的实施例，半导体器件具有具有与第一表面相对的第一表面和第二表面的基板。 此外，基板具有第一孔。 多个引线设置在基板的第一表面上，并且模板设置在第一孔中。 此外，密封剂设置在管芯片和多个引线上。
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公开(公告)号：US20140291823A1
公开(公告)日：2014-10-02
申请号：US14306243
申请日：2014-06-17
IPC分类号： H01L23/495 , H01L25/00
CPC分类号： H01L23/49568 , H01L23/3107 , H01L23/4334 , H01L23/49575 , H01L24/40 , H01L24/45 , H01L24/48 , H01L24/49 , H01L25/50 , H01L2224/16245 , H01L2224/32145 , H01L2224/32245 , H01L2224/40245 , H01L2224/40247 , H01L2224/45124 , H01L2224/45139 , H01L2224/45144 , H01L2224/45147 , H01L2224/45565 , H01L2224/48091 , H01L2224/48105 , H01L2224/48247 , H01L2224/48465 , H01L2224/4848 , H01L2224/49113 , H01L2224/73221 , H01L2224/73253 , H01L2224/84801 , H01L2224/8485 , H01L2224/85207 , H01L2224/85214 , H01L2224/85801 , H01L2224/92247 , H01L2924/00014 , H01L2924/014 , H01L2924/12032 , H01L2924/12042 , H01L2924/1301 , H01L2924/13034 , H01L2924/1305 , H01L2924/1306 , H01L2924/13091 , H01L2924/181 , H01L2224/45664 , H01L2924/00 , H01L2924/00012 , H01L2224/37099
摘要： Embodiments provide provides a chip package. The chip package may include a leadframe having a die pad and a plurality of lead fingers; a first chip attached to the die pad, the first chip being bonded to one or more of the lead fingers via a first set of wire bonds; a second chip bonded to one or more of the lead fingers via flip chip; and a heat slug attached to the second chip.
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公开(公告)号：US20140183711A1
公开(公告)日：2014-07-03
申请号：US13733761
申请日：2013-01-03
IPC分类号： H01L23/498 , H01L21/768
CPC分类号： H01L21/768 , H01L21/561 , H01L23/13 , H01L23/3128 , H01L23/3135 , H01L23/3675 , H01L23/49861 , H01L24/97 , H01L25/0652 , H01L25/16 , H01L2224/05554 , H01L2224/48091 , H01L2224/48227 , H01L2224/48471 , H01L2224/49171 , H01L2224/49175 , H01L2924/07802 , H01L2924/13034 , H01L2924/1305 , H01L2924/13091 , H01L2924/15787 , H01L2924/16195 , H01L2924/181 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： In accordance with an embodiment of the present invention, a semiconductor device has a substrate having a first surface and a second surface opposite the first surface. Also, the substrate has a first hole. A plurality of leads is disposed over the first surface of the substrate and a die paddle is disposed in the first hole. Additionally, an encapsulant is disposed on the die paddle and the plurality of leads.
摘要翻译： 根据本发明的实施例，半导体器件具有具有与第一表面相对的第一表面和第二表面的基板。 此外，基板具有第一孔。 多个引线设置在基板的第一表面上，并且模板设置在第一孔中。 此外，密封剂设置在管芯片和多个引线上。
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