Invention Grant
- Patent Title: Memory cells with recessed electrode contacts
- Patent Title (中): 具有凹陷电极触点的存储单元
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Application No.: US14019061Application Date: 2013-09-05
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Publication No.: US09147839B2Publication Date: 2015-09-29
- Inventor: Scott E. Sills , D. V. Nirmal Ramaswamy
- Applicant: Micron Technology Inc.
- Applicant Address: US ID Boise
- Assignee: Micron Technology, Inc.
- Current Assignee: Micron Technology, Inc.
- Current Assignee Address: US ID Boise
- Agency: Brooks, Cameron & Huebsch, PLLC
- Main IPC: H01L45/00
- IPC: H01L45/00

Abstract:
Memory cells with recessed electrode contacts and methods of forming the same are provided. An example memory cell can include an electrode contact formed in a substrate. An upper surface of the electrode contact is recessed a distance relative to an upper surface of the substrate. A first portion of a memory element is formed on an upper surface of the electrode contact and the upper surface of the substrate.
Public/Granted literature
- US20150060751A1 MEMORY CELLS WITH RECESSED ELECTRODE CONTACTS Public/Granted day:2015-03-05
Information query
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