发明授权
- 专利标题: Mounting structure of circuit board having multi-layered ceramic capacitor thereon
- 专利标题(中): 具有多层陶瓷电容器的电路板的安装结构
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申请号: US13481348申请日: 2012-05-25
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公开(公告)号: US09148955B2公开(公告)日: 2015-09-29
- 发明人: Young Ghyu Ahn , Byoung Hwa Lee , Min Cheol Park , Sang Soo Park , Dong Seok Park
- 申请人: Young Ghyu Ahn , Byoung Hwa Lee , Min Cheol Park , Sang Soo Park , Dong Seok Park
- 申请人地址: KR Suwon-Si, Gyeonggi-Do
- 专利权人: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- 当前专利权人: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- 当前专利权人地址: KR Suwon-Si, Gyeonggi-Do
- 代理机构: McDermott Will & Emery LLP
- 优先权: KR10-2011-0050103 20110526
- 主分类号: H05K1/18
- IPC分类号: H05K1/18 ; H05K1/11 ; H05K3/34
摘要:
Disclosed herein is a mounting structure of a circuit board having a multi-layered ceramic capacitor thereon. The mounting structure of a circuit board having a multi-layered ceramic capacitor thereon, in which a dielectric layer on which inner electrodes are disposed is stacked and external electrode terminals connecting the inner electrodes in parallel are disposed on both ends thereof, wherein the inner electrodes of the multi-layered ceramic capacitor and the circuit board are disposed so as to be a horizontal direction to connect the external electrode terminals with a land on the circuit board by a conductive material and a ratio of a bonding area ASOLEDER of the conductive material to the area AMLCC of the external electrode terminals AMLCC is set to be less than 1.4, thereby remarkably reducing the vibration noise.