Invention Grant
- Patent Title: Collapsible chimney for electronic device
- Patent Title (中): 电子设备可折叠烟囱
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Application No.: US13710819Application Date: 2012-12-11
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Publication No.: US09152190B2Publication Date: 2015-10-06
- Inventor: Douglas Heymann , Jered H. Wikander , Mark MacDonald
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Alpine Technology Law Group LLC
- Main IPC: G06F1/20
- IPC: G06F1/20 ; H05K7/20 ; G06F1/16
Abstract:
In one embodiment a housing for an electronic device comprises a first section, a second section, and a collapsible chimney coupled to the first section and the second section to provide an airflow path from a portion of the first section. Other embodiments may be described.
Public/Granted literature
- US20140160668A1 COLLAPSIBLE CHIMNEY FOR ELECTRONIC DEVICE Public/Granted day:2014-06-12
Information query
