Invention Grant
US09159659B2 Semiconductor package and method of manufacturing the semiconductor package 有权
半导体封装及半导体封装的制造方法

Semiconductor package and method of manufacturing the semiconductor package
Abstract:
A semiconductor package includes a first semiconductor chip, a second semiconductor chip and a sealing member. The first semiconductor chip includes a substrate having a first surface and a second surface opposite to the first surface and having an opening that extends in a predetermined depth from the second surface, and a plurality of through electrodes extending in a thickness direction from the first surface, end portions of the through electrodes being exposed through a bottom surface of the opening. The second semiconductor chip is received in the opening and mounted on the bottom surface of the opening. The sealing member covers the second semiconductor chip in the opening.
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