发明授权
US09159692B2 Millimeter wave wafer level chip scale packaging (WLCSP) device and related method
有权
毫米波晶片级芯片级封装（WLCSP）器件及相关方法
- 专利标题： Millimeter wave wafer level chip scale packaging (WLCSP) device and related method
- 专利标题（中）： 毫米波晶片级芯片级封装（WLCSP）器件及相关方法
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申请号： US14519590申请日： 2014-10-21
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公开(公告)号： US09159692B2公开(公告)日： 2015-10-13
- 发明人: Hanyi Ding , Richard S. Graf , Gary R. Hill , Wayne H. Woods, Jr.
- 申请人： International Business Machines Corporation
- 申请人地址： US NY Armonk
- 专利权人： International Business Machines Corporation
- 当前专利权人： International Business Machines Corporation
- 当前专利权人地址： US NY Armonk
- 代理机构： Hoffman Warnick LLC
- 代理商 David A. Cain
- 主分类号： H01L23/492
- IPC分类号： H01L23/492 ; H01L23/00 ; H01L23/498 ; H01L23/522 ; H01L23/66 ; H01L21/66 ; H01L23/31
摘要：
Various embodiments include wafer level chip scale package (WLCSP) structures and methods of tuning such structures. In some embodiments, the WLCSP structure includes: a printed circuit board (PCB) trace connection including at least one PCB ground connection connected with a PCB ground plane; a set of ground solder balls each contacting the printed circuit board trace connection; a set of chip pads contacting each of the ground solder balls in the set of ground solder balls; a chip ground plane connecting the set of chip pads; and a signal interconnect interposed between two of the set of ground solder balls, the signal interconnect including: a signal trace connection electrically isolated from the PCB ground plane; a signal ball contacting the signal PCB trace connection; a chip pad contacting the signal ball, and a signal trace connection on a chip contacting the chip pad.
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