发明授权
US09164001B2 Using an LED die to measure temperature inside silicone that encapsulates an LED array
有权
使用LED芯片测量封装LED阵列的硅胶内的温度
- 专利标题: Using an LED die to measure temperature inside silicone that encapsulates an LED array
- 专利标题(中): 使用LED芯片测量封装LED阵列的硅胶内的温度
-
申请号: US13930672申请日: 2013-06-28
-
公开(公告)号: US09164001B2公开(公告)日: 2015-10-20
- 发明人: Babak Imangholi , Michael Neal Gershowitz , R. Scott West
- 申请人: Bridgelux, Inc.
- 申请人地址: US CA Livermore
- 专利权人: Bridgelux, Inc.
- 当前专利权人: Bridgelux, Inc.
- 当前专利权人地址: US CA Livermore
- 代理机构: Imperium Patent Works
- 代理商 Darien K. Wallace
- 主分类号: H05B37/02
- IPC分类号: H05B37/02 ; G01K7/00 ; H05B33/08
摘要:
A light-emitting diode (LED) device includes first and second LED dies with the same structure and that are both encapsulated by the same silicone layer. The first LED is supplied with sufficient drive current to illuminate the LED. Control circuitry supplies the second LED with a constant current, determines the voltage across the second LED, and calculates the temperature of the second LED based on the voltage across the second LED. The constant current has a maximum magnitude that never exceeds the maximum magnitude of the drive current. The LED device is able to calculate the temperature of a diode with a gallium-nitride layer (GaN or GaInN) that is receiving a large drive current and emitting blue light by determining the voltage across an adjacent similar diode with a gallium-nitride layer through which a small constant current is flowing. Preferably, the band gap of the LEDs exceeds two electron volts.
公开/授权文献
信息查询