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    Light emitting diode constructions and methods for making the same
    1.
    发明授权
    Light emitting diode constructions and methods for making the same 有权

    公开(公告)号：US11245058B2

    公开(公告)日：2022-02-08

    申请号：US16416032

    申请日：2019-05-17

    申请人： Bridgelux, Inc.

    发明人： Vladimir A. Odnoblyudov ,  R. Scott West

    IPC分类号： H01L33/58 ,  H01L33/62 ,  H01L21/56

    摘要： Light emitting diode (LED) constructions comprise an LED having a pair of electrical contacts along a bottom surface. A lens is disposed over the LED and covers a portion of the LED bottom surface. A pair of electrical terminals is connected with respective LED contacts, are sized larger than the contacts, and connect with the lens material along the LED bottom surface. A wavelength converting material may be interposed between the LED and the lens. LED constructions may comprise a number of LEDs, where the light emitted by each LED differs from one another by about 2.5 nm or less. LED constructions are made by attaching 2 or more LEDs to a common wafer by adhesive layer, forming a lens on a wafer level over each LED to provide a rigid structure, removing the common wafer, forming the electrical contacts on a wafer level, and then separating the LEDs.

    PACKAGING PHOTON BUILDING BLOCKS WITH TOP SIDE CONNECTIONS AND INTERCONNECT STRUCTURE
    2.
    发明申请
    PACKAGING PHOTON BUILDING BLOCKS WITH TOP SIDE CONNECTIONS AND INTERCONNECT STRUCTURE 审中-公开

    公开(公告)号：US20200035888A1

    公开(公告)日：2020-01-30

    申请号：US16502530

    申请日：2019-07-03

    申请人： BRIDGELUX, INC.

    发明人： R. Scott West

    IPC分类号： H01L33/62 ,  H01L33/64 ,  H05K1/02

    摘要： Standardized photon building blocks are used to make both discrete light emitters as well as array products. Each photon building block has one or more LED chips mounted on a substrate. No electrical conductors pass between the top and bottom surfaces of the substrate. The photon building blocks are supported by an interconnect structure that is attached to a heat sink. Landing pads on the top surface of the substrate of each photon building block are attached to contact pads disposed on the underside of a lip of the interconnect structure. In a solder reflow process, the photon building blocks self-align within the interconnect structure. Conductors on the interconnect structure are electrically coupled to the LED dice in the photon building blocks through the contact pads and landing pads. The bottom surface of the interconnect structure is coplanar with the bottom surfaces of the substrates of the photon building blocks.

    Light emitting diode constructions and methods for making the same
    3.
    发明授权
    Light emitting diode constructions and methods for making the same 有权

    公开(公告)号：US10297731B2

    公开(公告)日：2019-05-21

    申请号：US14555508

    申请日：2014-11-26

    申请人： Bridgelux, Inc.

    发明人： Vladimir A. Odnoblyudov ,  R. Scott West

    IPC分类号： H01L33/58 ,  H01L33/62 ,  H01L21/56

    摘要： Light emitting diode (LED) constructions comprise an LED having a pair of electrical contacts along a bottom surface. A lens is disposed over the LED and covers a portion of the LED bottom surface. A pair of electrical terminals is connected with respective LED contacts, are sized larger than the contacts, and connect with the lens material along the LED bottom surface. A wavelength converting material may be interposed between the LED and the lens. LED constructions may comprise a number of LEDs, where the light emitted by each LED differs from one another by about 2.5 nm or less. LED constructions are made by attaching 2 or more LEDs to a common wafer by adhesive layer, forming a lens on a wafer level over each LED to provide a rigid structure, removing the common wafer, forming the electrical contacts on a wafer level, and then separating the LEDs.

    Using an LED die to measure temperature inside silicone that encapsulates an LED array
    4.
    发明授权
    Using an LED die to measure temperature inside silicone that encapsulates an LED array 有权
    使用LED芯片测量封装LED阵列的硅胶内的温度

    公开(公告)号：US09164001B2

    公开(公告)日：2015-10-20

    申请号：US13930672

    申请日：2013-06-28

    申请人： Bridgelux, Inc.

    发明人： Babak Imangholi ,  Michael Neal Gershowitz ,  R. Scott West

    IPC分类号： H05B37/02 ,  G01K7/00 ,  H05B33/08

    CPC分类号： G01K7/00 ,  G01K7/01 ,  H01L27/156 ,  H01L33/32 ,  H01L33/502 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/49107 ,  H01L2224/73265 ,  H01L2224/8592 ,  H01L2924/181 ,  H05B33/0851 ,  H05B37/02 ,  H01L2924/00014 ,  H01L2924/00012

    摘要： A light-emitting diode (LED) device includes first and second LED dies with the same structure and that are both encapsulated by the same silicone layer. The first LED is supplied with sufficient drive current to illuminate the LED. Control circuitry supplies the second LED with a constant current, determines the voltage across the second LED, and calculates the temperature of the second LED based on the voltage across the second LED. The constant current has a maximum magnitude that never exceeds the maximum magnitude of the drive current. The LED device is able to calculate the temperature of a diode with a gallium-nitride layer (GaN or GaInN) that is receiving a large drive current and emitting blue light by determining the voltage across an adjacent similar diode with a gallium-nitride layer through which a small constant current is flowing. Preferably, the band gap of the LEDs exceeds two electron volts.

    摘要翻译： 发光二极管（LED）装置包括具有相同结构的第一和第二LED管芯，并且都被相同的硅氧烷层封装。 第一个LED提供足够的驱动电流来照亮LED。 控制电路为第二个LED提供恒定电流，确定第二个LED两端的电压，并根据第二个LED两端的电压计算第二个LED的温度。 恒定电流具有不超过驱动电流的最大幅度的最大幅度。 LED器件能够通过用氮化镓层（GaN或GaInN）来测量具有氮化镓层（GaN或GaInN）的温度，该氮化镓层接收大的驱动电流并通过确定具有氮化镓层的相邻类似二极管的电压来发射蓝光 其流过小的恒定电流。 优选地，LED的带隙超过两个电子伏特。

    MICRO-BEAD BLASTING PROCESS FOR REMOVING A SILICONE FLASH LAYER
    6.
    发明申请
    MICRO-BEAD BLASTING PROCESS FOR REMOVING A SILICONE FLASH LAYER 有权
    用于去除硅胶闪光层的微珠喷砂工艺

    公开(公告)号：US20130337592A1

    公开(公告)日：2013-12-19

    申请号：US13972887

    申请日：2013-08-21

    申请人： Bridgelux, Inc.

    发明人： R. Scott West ,  Tao Tong ,  Mike Kwon

    IPC分类号： H01L33/58

    CPC分类号： H01L33/56 ,  B24C1/003 ,  B24C1/04 ,  B24C3/322 ,  H01L25/0753 ,  H01L33/54 ,  H01L33/58 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2933/0033 ,  H01L2933/005 ,  H01L2924/00 ,  H01L2924/00014

    摘要： Using compression molding to form lenses over LED arrays on a metal core printed circuit board leaves a flash layer of silicone covering the contact pads that are later required to connect the arrays to power. A method for removing the flash layer involves blasting particles of sodium bicarbonate at the flash layer. A nozzle is positioned within thirty millimeters of the top surface of the flash layer. The stream of air that exits from the nozzle is directed towards the top surface at an angle between five and thirty degrees away from normal to the top surface. The particles of sodium bicarbonate are added to the stream of air and then collide into the top surface of the silicone flash layer until the flash layer laterally above the contact pads is removed. The edge of silicone around the cleaned contact pad thereafter contains a trace amount of sodium bicarbonate.

    摘要翻译： 使用压缩成型在金属芯印刷电路板上的LED阵列上形成透镜，留下覆盖接触焊盘的硅胶闪光层，这些接触焊盘将阵列连接到电源。 去除闪蒸层的方法包括在闪蒸层处喷射碳酸氢钠颗粒。 喷嘴位于闪光层顶表面三十毫米内。 从喷嘴出来的空气流以垂直于顶表面的五至三十度之间的角度指向顶表面。 将碳酸氢钠颗粒加入到空气流中，然后碰撞到硅氧烷闪蒸层的顶表面，直到去除接触垫横向上方的闪蒸层。 清洁的接触垫周围的硅树脂的边缘其后含有痕量的碳酸氢钠。

    Packaging photon building blocks with top side connections and interconnect structure
    7.
    发明授权
    Packaging photon building blocks with top side connections and interconnect structure 有权

    公开(公告)号：US10347807B2

    公开(公告)日：2019-07-09

    申请号：US13724830

    申请日：2012-12-21

    申请人： Bridgelux, Inc.

    发明人： R. Scott West

    IPC分类号： H01L33/64 ,  H01L33/48 ,  H01L33/62 ,  H05K1/02 ,  H01L23/00 ,  H01L25/075 ,  H05K3/00

    摘要： Standardized photon building blocks are used to make both discrete light emitters as well as array products. Each photon building block has one or more LED chips mounted on a substrate. No electrical conductors pass between the top and bottom surfaces of the substrate. The photon building blocks are supported by an interconnect structure that is attached to a heat sink. Landing pads on the top surface of the substrate of each photon building block are attached to contact pads disposed on the underside of a lip of the interconnect structure. In a solder reflow process, the photon building blocks self-align within the interconnect structure. Conductors on the interconnect structure are electrically coupled to the LED dice in the photon building blocks through the contact pads and landing pads. The bottom surface of the interconnect structure is coplanar with the bottom surfaces of the substrates of the photon building blocks.

    Packaging a substrate with an LED into an interconnect structure only through top side landing pads on the substrate
    8.
    发明授权
    Packaging a substrate with an LED into an interconnect structure only through top side landing pads on the substrate 有权

    公开(公告)号：US10325890B2

    公开(公告)日：2019-06-18

    申请号：US15968686

    申请日：2018-05-01

    申请人： Bridgelux, Inc.

    发明人： R. Scott West ,  Tao Tong ,  Mike Kwon ,  Michael Solomensky

    IPC分类号： H01L25/075 ,  H01L33/48 ,  H01L33/58 ,  H01L33/54 ,  H01L33/60 ,  H01L33/62 ,  H01L33/64 ,  H01L33/50

    摘要： Standardized photon building blocks are packaged in molded interconnect structures to form a variety of LED array products. No electrical conductors pass between the top and bottom surfaces of the substrate upon which LED dies are mounted. Microdots of highly reflective material are jetted onto the top surface. Landing pads on the top surface of the substrate are attached to contact pads disposed on the underside of a lip of the interconnect structure. In a solder reflow process, the photon building blocks self-align within the interconnect structure. Conductors in the interconnect structure are electrically coupled to the LED dies in the photon building blocks through the contact pads and landing pads. Compression molding is used to form lenses over the LED dies and leaves a flash layer of silicone covering the landing pads. The flash layer laterally above the landing pads is removed by blasting particles at the flash layer.