A system of interconnected chips comprising a multi-chip module (MCM) includes a processor chip, a system functions chip, and an MCM package configured to include the processor chip, the system functions chip, and an interconnect circuit. The processor chip is configured to include a first ground-referenced single-ended signaling interface circuit. A first set of electrical traces manufactured within the MCM package and configured to couple the first single-ended signaling interface circuit to the interconnect circuit. The system functions chip is configured to include a second single-ended signaling interface circuit and a host interface. A second set of electrical traces manufactured within the MCM package and configured to couple the host interface to at least one external pin of the MCM package. In one embodiment, each single-ended signaling interface advantageously implements ground-referenced single-ended signaling.