发明授权
- 专利标题： Packaging substrate and fabrication method thereof
- 专利标题（中）： 包装基板及其制造方法
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申请号： US13566265申请日： 2012-08-03
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公开(公告)号： US09171741B2公开(公告)日： 2015-10-27
- 发明人: Wei-Ping Wang , Pang-Chun Lin , Chin-Chih Hsiao , Kaun-i Cheng , Cheng-Wen Chiu
- 申请人： Wei-Ping Wang , Pang-Chun Lin , Chin-Chih Hsiao , Kaun-i Cheng , Cheng-Wen Chiu
- 申请人地址： TW Taichung
- 专利权人： Siliconware Precision Industries Co., Ltd.
- 当前专利权人： Siliconware Precision Industries Co., Ltd.
- 当前专利权人地址： TW Taichung
- 代理机构： Mintz Levin Cohn Ferris Glovsky and Popeo, P.C.
- 代理商 Peter F. Corless; Steven M. Jensen
- 优先权： TW100140495A 20111107
- 主分类号： H01L21/48
- IPC分类号： H01L21/48 ; H01L23/498 ; H01L23/31 ; H01L23/00
摘要：
A method for fabricating a packaging substrate includes: providing a carrier having a first metal layer and a second metal layer formed on the first metal layer; forming a first circuit layer on the second metal layer and forming a separating portion on an edge of the second metal layer such that the separating portion is spaced from the first circuit layer; forming a dielectric layer on the second metal layer and the first circuit layer such that the first circuit layer and the separating portion are embedded in the dielectric layer and portions of the dielectric layer are formed between the first circuit layer and the separating portion; forming a second circuit layer on the dielectric layer; and applying forces on the separating portion so as to remove the first metal layer and the carrier, thereby maintaining the integrity of the first circuit layer.
公开/授权文献
- US20130115738A1 PACKAGING SUBSTRATE AND FABRICATION METHOD THEREOF 公开/授权日：2013-05-09
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