发明授权
- 专利标题: Substrate treatment apparatus and method for manufacturing thin film
- 专利标题(中): 基板处理装置及薄膜制造方法
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申请号: US13643873申请日: 2010-04-28
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公开(公告)号: US09171745B2公开(公告)日: 2015-10-27
- 发明人: Mitsuhiro Suzuki , Takeshi Kijima , Yuuji Honda
- 申请人: Mitsuhiro Suzuki , Takeshi Kijima , Yuuji Honda
- 申请人地址: JP Chiba
- 专利权人: YOUTEC CO., LTD.
- 当前专利权人: YOUTEC CO., LTD.
- 当前专利权人地址: JP Chiba
- 代理机构: Wenderoth, Lind & Ponack, L.L.P.
- 国际申请: PCT/JP2010/057919 WO 20100428
- 国际公布: WO2011/135731 WO 20111103
- 主分类号: B05C11/08
- IPC分类号: B05C11/08 ; B05D3/12 ; H01L21/67 ; B05C11/02 ; H01L21/02 ; B05D3/04 ; B05D1/00
摘要:
To provide a substrate treatment apparatus capable of suppressing adherence of dust to a film coated on a substrate. As an aspect of the present invention is a substrate treatment apparatus provided with a spin-coating treatment chamber 4a for coating a film on the substrate by spin-coating, a first air-conditioning mechanism that regulates an amount of dust in the air in the spin-coating treatment chamber, an annealing treatment chamber 7a for performing lamp annealing treatment on the film coated on the substrate, a conveying chamber 2a that is connected to each of the spin-coating treatment chamber and the annealing treatment chamber and is for conveying the substrate between the spin-coating treatment chamber and the annealing treatment chamber each other, and a second air-conditioning mechanism that regulate an amount of dust in the air in the conveying chamber.
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