Invention Grant
- Patent Title: Semiconductor packages and methods of manufacturing the same
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Application No.: US14595638Application Date: 2015-01-13
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Publication No.: US09171821B2Publication Date: 2015-10-27
- Inventor: Doojin Kim , Youngsik Kim , Kitaik Oh , Sungbok Hong
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR
- Agency: Onello & Mello, LLP
- Priority: KR10-2012-0012926 20120208
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H01L23/00 ; H01L25/065
Abstract:
A semiconductor package comprises a board including a board pad, a plurality of semiconductor chips mounted on the board, the semiconductor chips including chip pads. Bumps are disposed on the chip pads, respectively, and a wire is disposed between the chip pads and the bumps. The wire electrically connects the chip pads of the plurality of semiconductor chips and the board pad to each other.
Public/Granted literature
- US20150125996A1 SEMICONDUCTOR PACKAGES AND METHODS OF MANUFACTURING THE SAME Public/Granted day:2015-05-07
Information query
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