公开(公告)号：US09171821B2

公开(公告)日：2015-10-27

申请号：US14595638

申请日：2015-01-13

Applicant: Samsung Electronics Co., Ltd.

Inventor： Doojin Kim ,  Youngsik Kim ,  Kitaik Oh ,  Sungbok Hong

IPC: H01L21/00 ,  H01L23/00 ,  H01L25/065

CPC classification number: H01L24/85 ,  H01L24/05 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/78 ,  H01L25/0657 ,  H01L2224/04042 ,  H01L2224/05624 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/4809 ,  H01L2224/48145 ,  H01L2224/48147 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/48599 ,  H01L2224/48616 ,  H01L2224/48624 ,  H01L2224/48992 ,  H01L2224/48997 ,  H01L2224/73265 ,  H01L2224/78301 ,  H01L2224/85181 ,  H01L2224/85365 ,  H01L2224/85416 ,  H01L2224/85951 ,  H01L2224/85986 ,  H01L2225/06506 ,  H01L2225/0651 ,  H01L2225/06562 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/48455

Abstract: A semiconductor package comprises a board including a board pad, a plurality of semiconductor chips mounted on the board, the semiconductor chips including chip pads. Bumps are disposed on the chip pads, respectively, and a wire is disposed between the chip pads and the bumps. The wire electrically connects the chip pads of the plurality of semiconductor chips and the board pad to each other.