Invention Grant
- Patent Title: Multi-chip light emitter packages and related methods
- Patent Title (中): 多芯片发光二极管封装及相关方法
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Application No.: US13796045Application Date: 2013-03-12
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Publication No.: US09172012B2Publication Date: 2015-10-27
- Inventor: Peter S. Andrews , Kurt S. Wilcox , Theodore Lowes , Bernd P. Keller
- Applicant: CREE, Inc.
- Applicant Address: US NC Durham
- Assignee: Cree, Inc.
- Current Assignee: Cree, Inc.
- Current Assignee Address: US NC Durham
- Agency: Jenkins, Wilson, Taylor & Hunt, P.A.
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H01L33/00 ; H01L33/58 ; H01L25/075 ; H01L33/54 ; H01L33/62 ; H01L33/64 ; H01L33/40 ; H01L23/00
Abstract:
Light emitter packages having multiple light emitter chips, such as light emitting diode (LED) chips, and related methods are provided. In one embodiment, a light emitter package can include a ceramic submount. An array of light emitter chips can be disposed over a portion of the submount, and each light emitter chip can include a horizontal chip structure having positive and negative electrical contacts disposed on a same side. The positive and negative electrical contacts can be adapted to electrically communicate to conductive portions of the submount. Light emitter packages can further include a lens overmolded on the submount and covering a portion of the array.
Public/Granted literature
- US20130256710A1 MULTI-CHIP LIGHT EMITTER PACKAGES AND RELATED METHODS Public/Granted day:2013-10-03
Information query
IPC分类:
