发明授权
- 专利标题: Die assembly on thin dielectric sheet
- 专利标题(中): 薄电介质片上的模具组装
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申请号: US14041722申请日: 2013-09-30
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公开(公告)号: US09177831B2公开(公告)日: 2015-11-03
- 发明人: Chia-Pin Chiu , Qing Ma , Robert L. Sankman , Paul B. Fischer , Patrick Morrow , William J. Lambert , Charles A. Gealer , Tyler Osborn
- 申请人: Chia-Pin Chiu , Qing Ma , Robert L. Sankman , Paul B. Fischer , Patrick Morrow , William J. Lambert , Charles A. Gealer , Tyler Osborn
- 申请人地址: US CA Santa Clara
- 专利权人: Intel Corporation
- 当前专利权人: Intel Corporation
- 当前专利权人地址: US CA Santa Clara
- 代理机构: Blakely, Sokoloff, Taylor & Zafman LLP
- 主分类号: H01L21/00
- IPC分类号: H01L21/00 ; H01L21/48 ; H01L23/538 ; H01L23/00 ; H01L23/15 ; H01L21/56 ; H01L23/31
摘要:
A die assembly formed on a thin dielectric sheet is described. In one example, a first and a second die have interconnect areas. A dielectric sheet, such as glass, silicon, or oxidized metal is applied over the interconnect areas of dies. Conductive vias are formed in the dielectric sheet to connect with pads of the interconnect areas. A build-up layer includes routing to connect pads of the first die interconnect area to pads of the second die interconnect area through the conductive vias and a cover is applied over the dies, the dielectric sheet, and the build-up layer.
公开/授权文献
- US20150091182A1 DIE ASSEMBLY ON THIN DIELECTRIC SHEET 公开/授权日:2015-04-02