Invention Grant
- Patent Title: Semiconductor constructions
- Patent Title (中): 半导体结构
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Application No.: US13675933Application Date: 2012-11-13
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Publication No.: US09178077B2Publication Date: 2015-11-03
- Inventor: Neal L. Davis , David A. Kewley
- Applicant: Micron Technology, Inc.
- Applicant Address: US ID Boise
- Assignee: Micron Technology, Inc.
- Current Assignee: Micron Technology, Inc.
- Current Assignee Address: US ID Boise
- Agency: Wells St. John P.S.
- Main IPC: H01L29/788
- IPC: H01L29/788 ; H01L29/792 ; H01L29/66 ; H01L27/115

Abstract:
Some embodiments include a semiconductor construction having a stack containing alternating levels of control gate material and intervening dielectric material. A channel material panel extends through the stack and along a first direction. The panel divides the stack into a first section on a first side of the panel and a second section on a second side of the panel. Memory cell stacks are between the channel material panel and the control gate material. The memory cell stacks include cell dielectric material shaped as containers having open ends pointing toward the channel material panel, and include charge-storage material within the containers. Some embodiments include methods of forming semiconductor constructions.
Public/Granted literature
- US20140131784A1 Semiconductor Constructions and Methods of Forming Semiconductor Constructions Public/Granted day:2014-05-15
Information query
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