Invention Grant
US09183340B2 Electronic device having circuit board with co-layout design of multiple connector placement sites and related circuit board thereof
有权
具有电路板的电子设备，具有多个连接器放置位置的相互配置设计及其相关电路板
- Patent Title: Electronic device having circuit board with co-layout design of multiple connector placement sites and related circuit board thereof
- Patent Title (中): 具有电路板的电子设备，具有多个连接器放置位置的相互配置设计及其相关电路板
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Application No.: US14158876Application Date: 2014-01-20
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Publication No.: US09183340B2Publication Date: 2015-11-10
- Inventor: Huai-Yuan Feng , Ching-Gu Pan , Yan-Bin Luo , Hua Wu , Shang-Yi Lin
- Applicant: MEDIATEK INC.
- Applicant Address: TW Science-Based Industrial Park, Hsin-Chu
- Assignee: MEDIATEK INC.
- Current Assignee: MEDIATEK INC.
- Current Assignee Address: TW Science-Based Industrial Park, Hsin-Chu
- Agent Winston Hsu; Scott Margo
- Main IPC: H05K1/11
- IPC: H05K1/11 ; H05K1/14 ; G06F17/50 ; H05K1/02
Abstract:
An electronic device includes an integrated circuit, a connector, and a circuit board. The integrated circuit includes a first signal processing circuit, a second signal processing circuit, and an interface multiplexer having a first input port electrically connected to the first signal processing circuit, a second input port electrically connected to the second signal processing circuit, and an output port arranged to be electrically connected to the first input port or the second input port. The circuit board carries the integrated circuit and has a plurality of connector placement sites, including at least a first connector placement site each dedicated to the first signal processing circuit and at least a second connector placement site each dedicated to the second signal processing circuit. The connector placement sites and the output port of the interface multiplexer are electrically connected in series. The connector is installed on one of the connector placement sites.
Public/Granted literature
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