Electronic device having circuit board with co-layout design of multiple connector placement sites and related circuit board thereof
    2.
    发明授权
    Electronic device having circuit board with co-layout design of multiple connector placement sites and related circuit board thereof 有权
    具有电路板的电子设备,具有多个连接器放置位置的相互配置设计及其相关电路板

    公开(公告)号:US09183340B2

    公开(公告)日:2015-11-10

    申请号:US14158876

    申请日:2014-01-20

    Applicant: MEDIATEK INC.

    Abstract: An electronic device includes an integrated circuit, a connector, and a circuit board. The integrated circuit includes a first signal processing circuit, a second signal processing circuit, and an interface multiplexer having a first input port electrically connected to the first signal processing circuit, a second input port electrically connected to the second signal processing circuit, and an output port arranged to be electrically connected to the first input port or the second input port. The circuit board carries the integrated circuit and has a plurality of connector placement sites, including at least a first connector placement site each dedicated to the first signal processing circuit and at least a second connector placement site each dedicated to the second signal processing circuit. The connector placement sites and the output port of the interface multiplexer are electrically connected in series. The connector is installed on one of the connector placement sites.

    Abstract translation: 电子设备包括集成电路,连接器和电路板。 集成电路包括第一信号处理电路,第二信号处理电路和接口多路复用器,其具有电连接到第一信号处理电路的第一输入端口,电连接到第二信号处理电路的第二输入端口和输出端 端口被布置成电连接到第一输入端口或第二输入端口。 电路板承载集成电路并且具有多个连接器放置位置,包括至少第一连接器放置位置,每个专用于第一信号处理电路和至少第二连接器放置位置,每个专用于第二信号处理电路。 接口多路复用器的连接器放置位置和输出端口串联电连接。 连接器安装在其中一个连接器放置位置上。

    ELECTRONIC DEVICE HAVING CIRCUIT BOARD WITH CO-LAYOUT DESIGN OF MULTIPLE CONNECTOR PLACEMENT SITES AND RELATED CIRCUIT BOARD THEREOF
    3.
    发明申请
    ELECTRONIC DEVICE HAVING CIRCUIT BOARD WITH CO-LAYOUT DESIGN OF MULTIPLE CONNECTOR PLACEMENT SITES AND RELATED CIRCUIT BOARD THEREOF 有权
    具有多个连接器放置站点及其相关电路板的配套设计的电路板的电子设备

    公开(公告)号:US20140137065A1

    公开(公告)日:2014-05-15

    申请号:US14158876

    申请日:2014-01-20

    Applicant: MEDIATEK INC.

    Abstract: An electronic device includes an integrated circuit, a connector, and a circuit board. The integrated circuit includes a first signal processing circuit, a second signal processing circuit, and an interface multiplexer having a first input port electrically connected to the first signal processing circuit, a second input port electrically connected to the second signal processing circuit, and an output port arranged to be electrically connected to the first input port or the second input port. The circuit board carries the integrated circuit and has a plurality of connector placement sites, including at least a first connector placement site each dedicated to the first signal processing circuit and at least a second connector placement site each dedicated to the second signal processing circuit. The connector placement sites and the output port of the interface multiplexer are electrically connected in series. The connector is installed on one of the connector placement sites.

    Abstract translation: 电子设备包括集成电路,连接器和电路板。 集成电路包括第一信号处理电路,第二信号处理电路和接口多路复用器,其具有电连接到第一信号处理电路的第一输入端口,电连接到第二信号处理电路的第二输入端口和输出端 端口被布置成电连接到第一输入端口或第二输入端口。 电路板承载集成电路并且具有多个连接器放置位置,包括至少第一连接器放置位置,每个专用于第一信号处理电路和至少第二连接器放置位置,每个专用于第二信号处理电路。 接口多路复用器的连接器放置位置和输出端口串联电连接。 连接器安装在其中一个连接器放置位置上。

    ELECTRONIC DEVICE AND METHOD FOR HANDLING ARTIFICIAL INTELLIGENCE MODEL SWITCHING

    公开(公告)号:US20250036977A1

    公开(公告)日:2025-01-30

    申请号:US18751335

    申请日:2024-06-23

    Applicant: MEDIATEK INC.

    Abstract: An electronic device is configured to execute instructions: compiling a first AI model and second AI model(s) to a first compiled file and second compiled file(s), respectively, wherein the first compiled file comprises a first data set and a first command set, and the second compiled file(s) comprises second data set(s) and second command set(s); generating light version file(s) for the AI model(s), wherein the light version file(s) comprises the second command set(s) and data patch(es); storing the first compiled file and the light version file(s) to a storage device; loading the first compiled file from the storage device to a memory; loading the light version file(s) from the storage device to the memory; generating the second data set(s) according to the first data set and the data patch(es); and executing the second AI model(s) according to the generated second data set(s) and the second command set(s) in the memory.

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