Invention Grant
- Patent Title: Detecting defects on a wafer with run time use of design data
- Patent Title (中): 使用设计数据运行时间检测晶圆上的缺陷
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Application No.: US14303602Application Date: 2014-06-13
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Publication No.: US09183624B2Publication Date: 2015-11-10
- Inventor: Laurent Karsenti , Brian Duffy
- Applicant: KLA-Tencor Corporation
- Applicant Address: US CA Milpitas
- Assignee: KLA-Tencor Corp.
- Current Assignee: KLA-Tencor Corp.
- Current Assignee Address: US CA Milpitas
- Agent Ann Marie Mewherter
- Main IPC: G06K9/00
- IPC: G06K9/00 ; G06T7/00

Abstract:
Methods and systems for detecting defects on a wafer are provided. One method includes creating a searchable database for a design for a wafer, which includes assigning values to different portions of the design based on patterns in the different portions of the design and storing the assigned values in the searchable database. Different portions of the design having substantially the same patterns are assigned the same values in the searchable database. The searchable database is configured such that searching of the database can be synchronized with generation of output for the wafer by one or more detectors of a wafer inspection system. Therefore, as the wafer is being scanned, design information for the output can be determined as fast as the output is generated, which enables multiple, desirable design based inspection capabilities.
Public/Granted literature
- US20140376801A1 Detecting Defects on a Wafer with Run Time Use of Design Data Public/Granted day:2014-12-25
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