中科微点-全球专利检索

  1. Login
  2. Sign Up

Search Results

38 records (took 0.018 seconds)

    Automated Pattern Fidelity Measurement Plan Generation
    1.
    发明申请
    Automated Pattern Fidelity Measurement Plan Generation 审中-公开

    公开(公告)号：US20190204237A1

    公开(公告)日：2019-07-04

    申请号：US16296132

    申请日：2019-03-07

    Applicant: KLA-Tencor Corporation

    Inventor： Brian Duffy ,  Ajay Gupta ,  Thanh Huy Ha

    IPC: G01N21/88 ,  G01N23/00 ,  G03F7/20 ,  G01N21/95

    Abstract: Methods and systems for determining parameter(s) of a metrology process to be performed on a specimen are provided. One system includes one or more computer subsystems configured for automatically generating regions of interest (Rats) to be measured during a metrology process performed for the specimen with the measurement subsystem based on a design for the specimen. The computer subsystem(s) are also configured for automatically determining parameter(s) of measurement(s) performed in first and second subsets of the ROIs during the metrology process with the measurement subsystem based on portions of the design for the specimen located in the first and second subsets of the ROIs, respectively. The parameter(s) of the measurement(s) performed in the first subset are determined separately and independently of the parameter(s) of the measurement(s) performed in the second subset.

    Detecting defects on a wafer with run time use of design data
    3.
    发明授权
    Detecting defects on a wafer with run time use of design data 有权
    使用设计数据运行时间检测晶圆上的缺陷

    公开(公告)号：US09183624B2

    公开(公告)日：2015-11-10

    申请号：US14303602

    申请日：2014-06-13

    Applicant: KLA-Tencor Corporation

    Inventor： Laurent Karsenti ,  Brian Duffy

    IPC: G06K9/00 ,  G06T7/00

    CPC classification number: G06T7/001 ,  G06T2207/10061 ,  G06T2207/30148

    Abstract: Methods and systems for detecting defects on a wafer are provided. One method includes creating a searchable database for a design for a wafer, which includes assigning values to different portions of the design based on patterns in the different portions of the design and storing the assigned values in the searchable database. Different portions of the design having substantially the same patterns are assigned the same values in the searchable database. The searchable database is configured such that searching of the database can be synchronized with generation of output for the wafer by one or more detectors of a wafer inspection system. Therefore, as the wafer is being scanned, design information for the output can be determined as fast as the output is generated, which enables multiple, desirable design based inspection capabilities.

    Abstract translation: 提供了用于检测晶片上的缺陷的方法和系统。 一种方法包括创建用于晶片设计的可搜索数据库，其包括基于设计的不同部分中的图案将值设计到设计的不同部分，并将所分配的值存储在可搜索的数据库中。 具有基本上相同图案的设计的不同部分在可搜索数据库中被分配相同的值。 可搜索数据库被配置为使得可以通过晶片检查系统的一个或多个检测器与数据库的搜索同步生成晶片的输出。 因此，当正在扫描晶片时，可以确定输出的设计信息与产生的输出一样快，这样可以实现多种基于设计的检测能力。

    Generating high resolution images from low resolution images for semiconductor applications
    4.
    发明授权
    Generating high resolution images from low resolution images for semiconductor applications 有权

    公开(公告)号：US10769761B2

    公开(公告)日：2020-09-08

    申请号：US16019422

    申请日：2018-06-26

    Applicant: KLA-Tencor Corporation

    Inventor： Saurabh Sharma ,  Amitoz Singh Dandiana ,  Mohan Mahadevan ,  Chao Fang ,  Amir Azordegan ,  Brian Duffy

    IPC: G06T5/00 ,  G06T3/40

    Abstract: Methods and systems for generating a high resolution image for a specimen from a low resolution image of the specimen are provided. One system includes one or more computer subsystems configured for acquiring a low resolution image of a specimen. The system also includes one or more components executed by the one or more computer subsystems. The one or more components include a deep convolutional neural network that includes one or more first layers configured for generating a representation of the low resolution image. The deep convolutional neural network also includes one or more second layers configured for generating a high resolution image of the specimen from the representation of the low resolution image. The second layer(s) include a final layer configured to output the high resolution image and configured as a sub-pixel convolutional layer.

    Identifying nuisances and defects of interest in defects detected on a wafer
    5.
    发明授权
    Identifying nuisances and defects of interest in defects detected on a wafer 有权

    公开(公告)号：US10699926B2

    公开(公告)日：2020-06-30

    申请号：US16113930

    申请日：2018-08-27

    Applicant: KLA-Tencor Corporation

    Inventor： Martin Plihal ,  Brian Duffy ,  Mike VonDenHoff ,  Andrew Cross ,  Kaushik Sah ,  Antonio Mani

    IPC: H01L21/67 ,  G06T7/00 ,  G01N21/95

    Abstract: Methods and systems fir identifying nuisances and defects of interest (DOIs) in defects detected on a wafer are provided. One method includes acquiring metrology data for the wafer generated by a metrology tool that performs measurements on the wafer at an array of measurement points. In one embodiment, the measurement points are determined prior to detecting the defects on the wafer and independently of the defects detected on the wafer. The method also includes determining locations of defects detected on the wafer with respect to locations of the measurement points on the wafer and assigning metrology data to the defects as a defect attribute based on the locations of the defects determined with respect to the locations of the measurement points. In addition, the method includes determining if the defects are nuisances or DOIs based on the defect attributes assigned to the defects.

    Hybrid inspection system for efficient process window discovery
    6.
    发明授权
    Hybrid inspection system for efficient process window discovery 有权

    公开(公告)号：US10551827B2

    公开(公告)日：2020-02-04

    申请号：US15727212

    申请日：2017-10-06

    Applicant: KLA-Tencor Corporation

    Inventor： Brian Duffy

    IPC: G06F17/50 ,  G05B19/418 ,  G03F7/20 ,  G03F1/84

    Abstract: An inspection system includes a controller communicatively coupled to a physical inspection device (PID), a virtual inspection device (VID) configured to analyze stored PID data, and a defect verification device (DVD). The controller may receive a pattern layout of a sample including multiple patterns fabricated with selected lithography configurations defining a process window, receive locations of PID-identified defects identified through analysis of the sample with the PID, wherein the PID-identified defects are verified by the DVD, remove one or more lithography configurations associated with the locations of the PID-identified defects from the process window, iteratively refine the process window by removing one or more lithography configurations associated with VID-identified defects identified through analysis of selected portions of stored PID data with the VID, and provide, as an output, the process window when a selected end condition is met.

    DETERMINING COORDINATES FOR AN AREA OF INTEREST ON A SPECIMEN
    9.
    发明申请
    DETERMINING COORDINATES FOR AN AREA OF INTEREST ON A SPECIMEN 审中-公开
    确定一个样本的兴趣区域的坐标

    公开(公告)号：US20160027164A1

    公开(公告)日：2016-01-28

    申请号：US14804102

    申请日：2015-07-20

    Applicant: KLA-Tencor Corporation

    Inventor： Brian Duffy ,  Michael Lennek ,  ChangHo Lee

    IPC: G06T7/00 ,  G06T5/50

    CPC classification number: G06T7/001 ,  G06T5/50 ,  G06T7/32 ,  G06T2207/10004 ,  G06T2207/20164 ,  G06T2207/30148

    Abstract: Methods and systems for determining coordinates for an area of interest on a specimen are provided. One system includes one or more computer subsystems configured for, for an area of interest on a specimen being inspected, identifying one or more targets located closest to the area of interest. The computer subsystem(s) are also configured for aligning one or more images for the one or more targets to a reference for the specimen. The image(s) for the target(s) and an image for the area of interest are acquired by an inspection subsystem during inspection of the specimen. The computer subsystem(s) are further configured for determining an offset between the image(s) for the target(s) and the reference based on results of the aligning and determining modified coordinates of the area of interest based on the offset and coordinates of the area of interest reported by the inspection subsystem.

    Abstract translation: 提供了用于确定样本上感兴趣区域的坐标的方法和系统。 一个系统包括一个或多个计算机子系统，其被配置用于针对被检查的样本上的感兴趣区域，识别位于最靠近感兴趣区域的一个或多个目标。 计算机子系统还被配置为将一个或多个目标的一个或多个图像对准样本的参考。 用于目标的图像和感兴趣区域的图像在检查样本期间由检查子系统获取。 计算机子系统还被配置为基于对准的结果和基于所关注区域的偏移和坐标来确定感兴趣区域的修改坐标来确定用于目标的图像和参考图像之间的偏移 检查子系统报告的感兴趣区域。

    Automated pattern fidelity measurement plan generation
    10.
    发明授权
    Automated pattern fidelity measurement plan generation 审中-公开

    公开(公告)号：US10670535B2

    公开(公告)日：2020-06-02

    申请号：US16296132

    申请日：2019-03-07

    Applicant: KLA-Tencor Corporation

    Inventor： Brian Duffy ,  Ajay Gupta ,  Thanh Huy Ha

    IPC: G01N21/88 ,  G03F7/20 ,  G01N21/95 ,  G01N23/00 ,  G01N21/956

    Abstract: Methods and systems for determining parameter(s) of a metrology process to be performed on a specimen are provided. One system includes one or more computer subsystems configured for automatically generating regions of interest (ROIs) to be measured during a metrology process performed for the specimen with the measurement subsystem based on a design for the specimen. The computer subsystem(s) are also configured for automatically determining parameter(s) of measurement(s) performed in first and second subsets of the ROIs during the metrology process with the measurement subsystem based on portions of the design for the specimen located in the first and second subsets of the ROIs, respectively. The parameter(s) of the measurement(s) performed in the first subset are determined separately and independently of the parameter(s) of the measurement(s) performed in the second subset.

Patent Agency Ranking