Invention Grant
- Patent Title: Data storage and stackable chip configurations
- Patent Title (中): 数据存储和堆叠芯片配置
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Application No.: US13765059Application Date: 2013-02-12
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Publication No.: US09183892B2Publication Date: 2015-11-10
- Inventor: HakJune Oh , Jin-Ki Kim , Hong Beom Pyeon
- Applicant: HakJune Oh , Jin-Ki Kim , Hong Beom Pyeon
- Applicant Address: CA Ottawa
- Assignee: Conversant Intellectual Property Management Inc.
- Current Assignee: Conversant Intellectual Property Management Inc.
- Current Assignee Address: CA Ottawa
- Agent Daniel Hammond
- Main IPC: H01L23/02
- IPC: H01L23/02 ; H01L23/34 ; H01L23/48 ; H01L23/52 ; H01L29/40 ; G11C5/06 ; G11C5/02 ; G11C5/04 ; H01L25/065

Abstract:
A first memory device and second memory device have a same input/output layout configuration. To form a stack, the second memory device is secured to the first memory device. To facilitate connectivity, the second memory device is rotationally offset with respect to the first memory device in the stack to align outputs of the first memory device with corresponding inputs of the second memory device. The rotational offset of the second memory device with respect to the first memory device aligns one or more outputs of the first memory device with one or more respective inputs of the second memory device. Based on links between outputs and inputs from one memory device to another in the stack, the stack of memory devices can include paths facilitating one or more series connection configurations through the memory devices.
Public/Granted literature
- US20130182485A1 Data Storage and Stackable Configurations Public/Granted day:2013-07-18
Information query
IPC分类: