发明授权
- 专利标题： Multi-layer interconnection structure
- 专利标题（中）： 多层互连结构
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申请号： US13939801申请日： 2013-07-11
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公开(公告)号： US09184063B2公开(公告)日： 2015-11-10
- 发明人: Yong Suk Yang , In-Kyu You , Jae Bon Koo , Yong-Young Noh
- 申请人： ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
- 申请人地址： KR Daejeon
- 专利权人： Electronics and Telecommunications Research Institute
- 当前专利权人： Electronics and Telecommunications Research Institute
- 当前专利权人地址： KR Daejeon
- 代理机构： Rabin & Berdo, P.C.
- 优先权： KR10-2009-0101136 20091023
- 主分类号： H01L21/48
- IPC分类号： H01L21/48 ; H05K1/09 ; H05K1/03 ; H05K1/02 ; H01L23/498 ; H05K3/40 ; H05K3/10 ; H05K3/12
摘要：
Provided are a multi-layer interconnection structure and a manufacturing method thereof. The multi-layer interconnection structure includes a substrate; a first wiring on the substrate; an interlayer insulation layer on the first wiring; a second wiring on the interlayer insulation layer; and a via contact including at least one conductive filament penetrating through the interlayer insulation layer between the second wiring and the first wiring to be electrically connected to the first wiring and the second wiring.
公开/授权文献
- US20130292160A1 MULTI-LAYER INTERCONNECTION STRUCTURE 公开/授权日：2013-11-07