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发明授权
US09184174B2 Semiconductor devices and methods of fabricating semiconductor devices 有权
半导体器件和制造半导体器件的方法

Semiconductor devices and methods of fabricating semiconductor devices
摘要：
Semiconductor devices are provided. A semiconductor device may include a substrate and a plurality of lines on the substrate. The semiconductor device may include a dielectric layer on the substrate and adjacent the plurality of lines. The semiconductor device may include a connection element in the dielectric layer. In some embodiments, the semiconductor device may include a plurality of contacts on the connection element, and a conductive interconnection on one of the plurality of contacts that are on the connection element and on a contact that is spaced apart from the connection element.
摘要（中）：

提供半导体器件。 半导体器件可以包括衬底和衬底上的多条线。 半导体器件可以包括在衬底上并与多条线相邻的电介质层。 该半导体器件可以包括介电层中的连接元件。 在一些实施例中，半导体器件可以包括连接元件上的多个触点，以及在连接元件上的多个触点中的一个触点上以及与连接元件间隔开的触点上的导电互连。

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