Invention Grant
- Patent Title: Backside illuminated color image sensors and methods for manufacturing the same
- Patent Title (中): 背面照明彩色图像传感器及其制造方法
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Application No.: US14270309Application Date: 2014-05-05
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Publication No.: US09184206B1Publication Date: 2015-11-10
- Inventor: Wei Zheng , Dyson Hsin-Chih Tai , Vincent Venezia
- Applicant: OmniVision Technologies, Inc.
- Applicant Address: US CA Santa Clara
- Assignee: OmniVision Technologies, Inc.
- Current Assignee: OmniVision Technologies, Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: Lathrop & Gage LLP
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H01L27/146 ; H01L21/762 ; H01L21/768
Abstract:
A method for manufacturing a backside illuminated color image sensor includes (a) modifying the frontside of an image sensor wafer, having pixel arrays, to produce electrical connections to the pixel arrays, wherein the electrical connections extend depth-wise into the image sensor wafer from the frontside, and (b) modifying the backside of the image sensor wafer to expose the electrical connections.
Public/Granted literature
- US20150318327A1 BACKSIDE ILLUMINATED COLOR IMAGE SENSORS AND METHODS FOR MANUFACTURING THE SAME Public/Granted day:2015-11-05
Information query
IPC分类:
