发明授权
- 专利标题： Vacuum deposition sources having heated effusion orifices
- 专利标题（中）： 真空沉积源具有加热的积液孔
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申请号： US12539443申请日： 2009-08-11
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公开(公告)号： US09187821B2公开(公告)日： 2015-11-17
- 发明人: Scott Wayne Priddy , Richard Charles Bresnahan
- 申请人： Scott Wayne Priddy , Richard Charles Bresnahan
- 申请人地址： US NY Plainview
- 专利权人： Veeco Instruments Inc.
- 当前专利权人： Veeco Instruments Inc.
- 当前专利权人地址： US NY Plainview
- 代理机构： Kagan Binder, PLLC
- 主分类号： C23C16/00
- IPC分类号： C23C16/00 ; C23C14/24 ; C23C14/06
摘要：
The present invention provides deposition sources that can efficiently and controllably provide vaporized material for deposition of thin film materials. Deposition sources described herein can be used to deposit any desired material and are particularly useful for depositing high melting point materials at high evaporation rates. An exemplary application for deposition sources of the present invention is deposition of copper, indium, and gallium in the manufacture of copper indium gallium diselenide based photovoltaic devices.
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