Invention Grant
- Patent Title: Photopolymerizable compositions for electroless plating methods
- Patent Title (中): 用于化学镀方法的光聚合组合物
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Application No.: US14197293Application Date: 2014-03-05
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Publication No.: US09188861B2Publication Date: 2015-11-17
- Inventor: Deepak Shukla , Mark R. Mis
- Applicant: Deepak Shukla , Mark R. Mis
- Applicant Address: US NY Rochester
- Assignee: EASTMAN KODAK COMPANY
- Current Assignee: EASTMAN KODAK COMPANY
- Current Assignee Address: US NY Rochester
- Agent J. Lanny Tucker
- Main IPC: G03F7/004
- IPC: G03F7/004 ; G03F7/038 ; G03F7/16

Abstract:
A photopolymerizable composition has five essential components: (a) a photopolymerizable epoxy material, (b) a photoacid generator such as an onium salt, (c) electron donor photosensitizer having an oxidation potential of at least 0.4 V and up to and including 3 V vs. SCE, and (d) metal particles. This photopolymerizable composition can be applied or printed onto one or both sides of various substrates to form articles that can be used to form electrically conductive materials. Methods for using the photopolymerizable compositions include electroless plating methods that can be carried out in roll-to-roll printing systems once various photocured patterns are formed from the photopolymerizable compositions.
Public/Granted literature
- US20150253661A1 PHOTOPOLYMERIZABLE COMPOSITIONS FOR ELECTROLESS PLATING METHODS Public/Granted day:2015-09-10
Information query
IPC分类: