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    PHOTOPOLYMERIZABLE COMPOSITIONS FOR ELECTROLESS PLATING METHODS
    2.
    发明申请
    PHOTOPOLYMERIZABLE COMPOSITIONS FOR ELECTROLESS PLATING METHODS 有权
    用于电镀法的光聚合组合物

    公开(公告)号：US20150227041A1

    公开(公告)日：2015-08-13

    申请号：US14174879

    申请日：2014-02-07

    Applicant: Deepak Shukla ,  Mark R. Mis

    Inventor： Deepak Shukla ,  Mark R. Mis

    IPC: G03F7/038

    CPC classification number: G03F7/038 ,  G03F7/0045 ,  G03F7/0047 ,  G03F7/028

    Abstract: A photopolymerizable composition has seven essential components: (a) a photopolymerizable epoxy material, (b) a photoacid generator such as an onium salt, (c) electron acceptor photosensitizer, (d) an electron donor co-initiator having an oxidation potential of 0.1 V to 3 V vs. SCE, (e) metal particles, and in some embodiments, (f) one or more free radically polymerizable compounds, and (g) one or more free radical photoinitiators. This photopolymerizable composition can be applied or printed onto one or both sides of various substrates to form articles that can be used to form electrically conductive materials. Methods for using the photopolymerizable compositions include electroless plating methods that can be carried out in roll-to-roll printing and plating systems once various photocured patterns are formed from the photopolymerizable compositions.

    Abstract translation: 可光聚合组合物具有七个基本组分：（a）光聚合环氧材料，（b）光酸产生剂如鎓盐，（c）电子受体光敏剂，（d）电子给体共引发剂，其氧化电位为0.1 V至3V对SCE，（e）金属颗粒，在一些实施方案中，（f）一种或多种可自由基自由基化合物，和（g）一种或多种自由基光引发剂。 该可光聚合组合物可以施加或印刷在各种基材的一面或两面上，以形成可用于形成导电材料的制品。 使用可光聚合组合物的方法包括一旦从光聚合组合物形成各种光固化图案，可以在辊对印刷和电镀系统中进行的化学镀方法。

    Forming patterns using thiosulfate polymer compositions
    3.
    发明授权
    Forming patterns using thiosulfate polymer compositions 有权
    使用硫代硫酸盐聚合物组合物形成图案

    公开(公告)号：US09005878B2

    公开(公告)日：2015-04-14

    申请号：US14158884

    申请日：2014-01-20

    Applicant: Deepak Shukla ,  Kevin M. Donovan ,  Mark R. Mis

    Inventor： Deepak Shukla ,  Kevin M. Donovan ,  Mark R. Mis

    IPC: G03F7/26 ,  G03F7/30

    CPC classification number: G03F7/30 ,  G03F7/0045 ,  G03F7/038 ,  G03F7/405

    Abstract: A thiosulfate polymer composition includes an electron-accepting photosensitizer component, either as a separate compound or as an attachment to the thiosulfate polymer. The thiosulfate polymer composition can be applied to various articles and used to form a predetermined polymeric pattern after photothermal reaction to form crosslinked disulfide bonds, removing non-crosslinked polymer, and reaction with a disulfide-reactive material.

    Abstract translation: 硫代硫酸盐聚合物组合物包括电子接受光敏剂组分，作为单独的化合物或作为与硫代硫酸盐聚合物的连接。 硫代硫酸盐聚合物组合物可以应用于各种制品，并且用于在光热反应之后形成预定的聚合物图案以形成交联的二硫键，除去未交联的聚合物和与二硫化物反应性材料的反应。

    Photopolymerizable compositions for electroless plating methods
    4.
    发明授权
    Photopolymerizable compositions for electroless plating methods 有权
    用于化学镀方法的光聚合组合物

    公开(公告)号：US09188861B2

    公开(公告)日：2015-11-17

    申请号：US14197293

    申请日：2014-03-05

    Applicant: Deepak Shukla ,  Mark R. Mis

    Inventor： Deepak Shukla ,  Mark R. Mis

    IPC: G03F7/004 ,  G03F7/038 ,  G03F7/16

    CPC classification number: G03F7/038 ,  G03F7/0045 ,  G03F7/0047 ,  G03F7/028 ,  G03F7/16

    Abstract: A photopolymerizable composition has five essential components: (a) a photopolymerizable epoxy material, (b) a photoacid generator such as an onium salt, (c) electron donor photosensitizer having an oxidation potential of at least 0.4 V and up to and including 3 V vs. SCE, and (d) metal particles. This photopolymerizable composition can be applied or printed onto one or both sides of various substrates to form articles that can be used to form electrically conductive materials. Methods for using the photopolymerizable compositions include electroless plating methods that can be carried out in roll-to-roll printing systems once various photocured patterns are formed from the photopolymerizable compositions.

    Abstract translation: 可光聚合组合物具有五个基本组分：（a）可光聚合的环氧材料，（b）光酸产生剂如鎓盐，（c）电子给体光敏剂，其氧化电位至少为0.4V且至多并包括3V 与SCE，（d）金属颗粒。 该可光聚合组合物可以施加或印刷在各种基材的一面或两面上以形成可用于形成导电材料的制品。 使用可光聚合组合物的方法包括一旦可光聚合组合物形成各种光固化图案，就可以在卷对卷印刷系统中进行的化学镀方法。

    PHOTOPOLYMERIZABLE COMPOSITIONS FOR ELECTROLESS PLATING METHODS
    5.
    发明申请
    PHOTOPOLYMERIZABLE COMPOSITIONS FOR ELECTROLESS PLATING METHODS 有权
    用于电镀法的光聚合组合物

    公开(公告)号：US20150253661A1

    公开(公告)日：2015-09-10

    申请号：US14197293

    申请日：2014-03-05

    Applicant: Deepak Shukla ,  Mark R. Mis

    Inventor： Deepak Shukla ,  Mark R. Mis

    IPC: G03F7/038 ,  G03F7/16

    CPC classification number: G03F7/038 ,  G03F7/0045 ,  G03F7/0047 ,  G03F7/028 ,  G03F7/16

    Abstract: A photopolymerizable composition has five essential components: (a) a photopolymerizable epoxy material, (b) a photoacid generator such as an onium salt, (c) electron donor photosensitizer having an oxidation potential of at least 0.4 V and up to and including 3 V vs. SCE, and (d) metal particles. This photopolymerizable composition can be applied or printed onto one or both sides of various substrates to form articles that can be used to form electrically conductive materials. Methods for using the photopolymerizable compositions include electroless plating methods that can be carried out in roll-to-roll printing systems once various photocured patterns are formed from the photopolymerizable compositions.

    Abstract translation: 可光聚合组合物具有五个基本组分：（a）可光聚合的环氧材料，（b）光酸产生剂如鎓盐，（c）电子给体光敏剂，其氧化电位至少为0.4V且至多并包括3V 与SCE，（d）金属颗粒。 该可光聚合组合物可以施加或印刷在各种基材的一面或两面上，以形成可用于形成导电材料的制品。 使用可光聚合组合物的方法包括一旦可光聚合组合物形成各种光固化图案，就可以在卷对卷印刷系统中进行的化学镀方法。

    ORGANIC POLYMERIC BI-METALLIC COMPOSITES
    6.
    发明申请
    ORGANIC POLYMERIC BI-METALLIC COMPOSITES 有权
    有机聚合物双金属复合材料

    公开(公告)号：US20150011699A1

    公开(公告)日：2015-01-08

    申请号：US14494712

    申请日：2014-09-24

    Applicant: Deepak Shukla ,  Dianne Marie Meyer ,  Mark R. Mis ,  Matthew Dirmyer

    Inventor： Deepak Shukla ,  Dianne Marie Meyer ,  Mark R. Mis ,  Matthew Dirmyer

    IPC: H01B3/44 ,  C08F22/10

    CPC classification number: H01B3/447 ,  C08F8/42 ,  C08F220/14 ,  C08F230/04 ,  C08K5/0091 ,  C08K5/56 ,  C08L33/04 ,  C08L67/02 ,  C08F220/24 ,  C08F220/20

    Abstract: Organic polymeric bi-metallic alkoxide or aryloxide composites are used as dielectric materials in various devices with improved properties such as improved mobility. These composites comprise a poly(meth)acrylate or polyester having metal coordination sites, and the same or different bi-metallic alkoxide or aryloxide molecules that are coordinated with the organic polymer. The bi-metallic alkoxide or aryloxide molecules can be represented by Structure (I) shown herein. Such composites are generally soluble at room temperature in various organic solvents and be provided in homogeneous organic solvent solutions that can be suitably applied to a substrate to form dielectric materials.

    Abstract translation: 有机聚合双金属醇盐或芳氧化物复合材料被用作具有改进的性能如改进的流动性的各种装置中的介电材料。 这些复合材料包含具有金属配位点的聚（甲基）丙烯酸酯或聚酯，以及与有机聚合物配位的相同或不同的双金属醇盐或芳氧化物分子。 双金属醇盐或芳氧化物分子可以由本文所示的结构（I）表示。 这种复合材料通常在室温下在各种有机溶剂中是可溶的，并且可以在均匀的有机溶剂溶液中提供，其可以适当地施加到基底上以形成电介质材料。

    FORMING PATTERNS USING THIOSULFATE POLYMER COMPOSITIONS
    7.
    发明申请
    FORMING PATTERNS USING THIOSULFATE POLYMER COMPOSITIONS 有权
    使用硫代聚合物组合物形成图案

    公开(公告)号：US20140287365A1

    公开(公告)日：2014-09-25

    申请号：US14158884

    申请日：2014-01-20

    Applicant: Deepak Shukla ,  Kevin M. Donovan ,  Mark R. Mis

    Inventor： Deepak Shukla ,  Kevin M. Donovan ,  Mark R. Mis

    IPC: G03F7/30

    CPC classification number: G03F7/30 ,  G03F7/0045 ,  G03F7/038 ,  G03F7/405

    Abstract: A thiosulfate polymer composition includes an electron-accepting photosensitizer component, either as a separate compound or as an attachment to the thiosulfate polymer. The thiosulfate polymer composition can be applied to various articles and used to form a predetermined polymeric pattern after photothermal reaction to form crosslinked disulfide bonds, removing non-crosslinked polymer, and reaction with a disulfide-reactive material.

    Abstract translation: 硫代硫酸盐聚合物组合物包括电子接受光敏剂组分，作为单独的化合物或作为与硫代硫酸盐聚合物的连接。 硫代硫酸盐聚合物组合物可以应用于各种制品，并且用于在光热反应之后形成预定的聚合物图案以形成交联的二硫键，除去未交联的聚合物和与二硫化物反应性材料的反应。

    ORGANIC POLYMERIC MULTI-METALLIC COMPOSITES
    8.
    发明申请
    ORGANIC POLYMERIC MULTI-METALLIC COMPOSITES 审中-公开
    有机聚合物多金属复合材料

    公开(公告)号：US20140128551A1

    公开(公告)日：2014-05-08

    申请号：US13671854

    申请日：2012-11-08

    Applicant: Deepak Shukla ,  Dianne M. Meyer ,  Mark R. Mis ,  Matthew Dirmyer

    Inventor： Deepak Shukla ,  Dianne M. Meyer ,  Mark R. Mis ,  Matthew Dirmyer

    IPC: C08F226/06 ,  C08F22/10

    CPC classification number: C08F230/04

    Abstract: Organic polymeric multi-metallic alkoxide or aryloxide composites are used as dielectric materials in various devices with improved properties such as improved mobility. These composites comprise an organic polymer comprising metal coordination sites, and multi-metallic alkoxide or aryloxide molecules that are coordinated with the organic polymer, the multi-metallic alkoxide or aryloxide molecules being represented by: (M)n(OR)x wherein at least one M is a metal selected from Group 2 of the Periodic Table and at least one other M is a metal selected from any of Groups 3 to 12 and Rows 4 and 5 of the Periodic Table, n is an integer of at least 2, R represents the same or different alkyl or aryl groups, and x is an integer of at least 2.

    Abstract translation: 有机聚合多金属醇盐或芳氧化物复合材料用作具有改进性能的各种装置中的介电材料，例如改进的流动性。 这些复合材料包括包含金属配位点的有机聚合物和与有机聚合物配位的多金属醇盐或芳氧化物分子，多金属醇盐或芳氧化物分子由以下表示：（M）n（OR）x，其中至少 一个M是选自元素周期表第2族的金属，并且至少一个其它M是选自元素周期表第3至12族和第4和5族中的任一个的金属，n是至少2的整数，R 表示相同或不同的烷基或芳基，x为至少2的整数。

    THIOSULFATE-CONTAINING POLYMERS ASSOCIATED WITH PHOTOSENSITIZER COMPONENT
    10.
    发明申请
    THIOSULFATE-CONTAINING POLYMERS ASSOCIATED WITH PHOTOSENSITIZER COMPONENT 有权
    与光敏元件相关的含硫聚合物的聚合物

    公开(公告)号：US20150361206A1

    公开(公告)日：2015-12-17

    申请号：US14301380

    申请日：2014-06-11

    Applicant: Deepak Shukla ,  Kevin M. Donovan ,  Mark R. Mis

    Inventor： Deepak Shukla ,  Kevin M. Donovan ,  Mark R. Mis

    IPC: C08F228/02 ,  H01B3/44 ,  C08F222/02 ,  C08F222/40 ,  C08F222/10

    CPC classification number: C08F228/02 ,  C08F220/14 ,  C08F222/02 ,  C08F222/10 ,  C08F222/40 ,  C08F2222/404 ,  H01B3/447 ,  C08F212/14 ,  C08F2220/303 ,  C08F220/36 ,  C08F2220/1858

    Abstract: A photocurable or thermally curable thiosulfate-containing polymer has (a) recurring units and (d) recurring units, shown as either Structure (I) or (II) and Structure (V) below: R represents the organic polymer backbone, G is a single bond or divalent linking group, Q+ is an organic charge balancing cation, M represents a charge balancing cation, and “a” represents at least 0.5 mol % and to 99.5 mol % of (a) recurring units; R″ represents the organic polymer backbone, G″ is a carbonyloxy group, R3 comprises a monovalent linear, branched, or carbocyclic non-aromatic hydrocarbon group having 1 to 18 carbon atoms, or it comprises a phenyl group having one or more such substituents, and “d” represents at least 0.5 mol % and to 99.5 mol % of (d) recurring units. These thiosulfate-containing polymers can be used to made dielectric compositions and gate dielectric layers in various devices.

    Abstract translation: 可光固化或热固化的含硫代硫酸盐的聚合物具有（a）重复单元和（d）如结构（I）或（II）和结构（V）所示的重复单元：R表示有机聚合物主链，G为 单键或二价连接基团，Q +是有机电荷平衡阳离子，M表示电荷平衡阳离子，“a”表示（a）重复单元的至少0.5摩尔％至99.5摩尔％ R“表示有机聚合物主链，G”是羰氧基，R3包括具有1至18个碳原子的一价直链，支链或碳环非芳族烃基，或其包含具有一个或多个这样的取代基的苯基， 和“d”表示（d）重复单元的至少0.5摩尔％至99.5摩尔％。 这些含硫代硫酸盐的聚合物可以用于制备各种装置中的电介质组合物和栅极电介质层。

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