发明授权
- 专利标题: Pattern forming method, alkali-developable thermosetting resin composition, printed circuit board and manufacturing method thereof
- 专利标题(中): 图案形成方法,碱显影性热固性树脂组合物,印刷电路板及其制造方法
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申请号: US13896966申请日: 2013-05-17
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公开(公告)号: US09188871B2公开(公告)日: 2015-11-17
- 发明人: Arata Endo , Shoji Minegishi , Masao Arima
- 申请人: TAIYO INK MFG. CO., LTD.
- 申请人地址: JP Hiki-gun
- 专利权人: TAIYO INK MFG. CO., LTD.
- 当前专利权人: TAIYO INK MFG. CO., LTD.
- 当前专利权人地址: JP Hiki-gun
- 代理机构: Oblon, McClelland, Maier & Neustadt, L.L.P.
- 优先权: JP2012-113859 20120517; JP2012-113863 20120517
- 主分类号: G03F7/20
- IPC分类号: G03F7/20 ; G03F7/038 ; H05K1/03 ; H05K3/28 ; H05K3/34
摘要:
[Problem] Provided are: a pattern forming method by which a pattern can be formed by development using a thermosetting resin composition and a cured layer having excellent curability can be obtained; a thermosetting resin composition used in the pattern forming method; and a printed circuit board.[Means for Solution] The pattern forming method according to the present invention is characterized by comprising the steps of: (A) forming a resin layer composed of an alkali-developable thermosetting resin composition comprising a photobase generator on a substrate; (B) activating the photobase generator contained in the alkali-developable thermosetting resin composition by irradiation with a light in a pattern form so as to cure an irradiated part; and (C) forming a negatively patterned layer by removing a non-irradiated part by alkali development.
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