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1.发明授权Curable composition, cured coating film prepared from curable composition, and printed wiring board including the cured film 有权可固化组合物，由可固化组合物制备的固化涂膜，以及包含固化膜的印刷线路板公开(公告)号：US09265156B2
公开(公告)日：2016-02-16
申请号：US14227249
申请日：2014-03-27
CPC分类号： H05K3/287 , H05K1/0393 , H05K2201/0154 , H05K2203/013
摘要： A curable composition to be used for a printed wiring board is disclosed, which has an excellent flexibility and an excellent adhesive property with respect to both a plastic substrate and a conductive layer in the printed wiring board. The curable composition includes (A) a (meth)acrylate compound having a polyene structure, (B) a (meth)acrylate compound having a hydroxyl group; and (C) a photopolymerization initiator. From the curable composition, a cured coating film, and a printed wiring board including the cured coating film in the form of a predetermined pattern are obtained.
摘要翻译： 公开了一种用于印刷电路板的可固化组合物，其对于印刷电路板中的塑料基板和导电层都具有优异的柔性和优异的粘合性能。 可固化组合物包括（A）具有多烯结构的（甲基）丙烯酸酯化合物，（B）具有羟基的（甲基）丙烯酸酯化合物; 和（C）光聚合引发剂。 从固化性组合物得到固化涂膜和包含固化涂膜的印刷线路板，其形式为预定图案。
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公开(公告)号：US09891523B2
公开(公告)日：2018-02-13
申请号：US14753655
申请日：2015-06-29
发明人： Daichi Okamoto , Nobuhito Ito , Shoji Minegishi
CPC分类号： G03F7/11 , G03F7/0385 , G03F7/0388 , G03F7/09 , H05K3/281 , H05K3/287 , H05K3/3452 , H05K2201/0129
摘要： Provided is a photosensitive dry film capable of forming a solder resist layer that has an excellent filling property of underfill and that exhibits an excellent adhesion with a mold material. The photosensitive dry film according to the present invention is a photosensitive dry film including a supporting film and a photosensitive resin layer provided on one side of the supporting film, wherein the arithmetic average surface roughness Ra of the side of the supporting film on which the photosensitive resin layer is provided is 50 to 390 nm.
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3.发明授权公开(公告)号：US09497856B2
公开(公告)日：2016-11-15
申请号：US13853161
申请日：2013-03-29
发明人： Daichi Okamoto , Shoji Minegishi , Masao Arima
IPC分类号： B32B15/00 , H05K1/03 , B32B27/08 , G03F7/027 , B32B27/26 , G03F7/095 , H05K3/28 , H05K3/34 , G03F7/032 , G03F7/085
CPC分类号： H05K1/036 , B32B27/08 , B32B27/26 , G03F7/027 , G03F7/032 , G03F7/085 , G03F7/0955 , H05K3/285 , H05K3/287 , H05K3/3452 , H05K2201/0195 , Y10T156/10
摘要： A laminated structure including a base material and resin insulating layers formed on the base material. The resin insulating layers include a resin insulating layer (A) containing a curing accelerator composed of an N atom-containing basic compound such that the resin insulating layer (A) is in contact with the base material. The laminated structure includes a resin insulating layer (B) which contains a P atom-containing curing accelerator in addition to the resin insulating layer (A).
摘要翻译： 一种叠层结构，包括形成在基材上的基材和树脂绝缘层。 树脂绝缘层包括含有由含N原子的碱性化合物构成的固化促进剂的树脂绝缘层（A），使得树脂绝缘层（A）与基材接触。 除了树脂绝缘层（A）之外，层压结构还包括含有含P原子的固化促进剂的树脂绝缘层（B）。
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4.发明授权Curable resin composition, cured product thereof, printed circuit board comprising the same, and method for producing the cured product 有权可固化树脂组合物，其固化产物，包含该组合物的印刷电路板及其制备方法公开(公告)号：US09298096B2
公开(公告)日：2016-03-29
申请号：US14324358
申请日：2014-07-07
发明人： Kazuya Okada , Shuichi Yamamoto , Shoji Minegishi , Daichi Okamoto , Xiaozhu Wei
CPC分类号： G03F7/40 , G03F7/038 , H05K1/03 , Y10T428/24802
摘要： An alkaline development-type curable resin composition having an excellent strength against tearing, breaking, distortion and torsion, and excellent toughness, a cured product of the curable resin composition, a printed circuit board having the cured product, and a process for manufacturing the cured product are disclosed. A curable resin composition is obtained, which contains (A) a thermoplastic resin, (B) a thermosetting component, (C) an alkali-soluble component, and at least one of (D-1) a photopolymerization initiator and (D-2) a photo-base generator, the thermoplastic resin (A) having two or more glass transition points including two glass transition points Tgx and Tgy, which satisfy Tgx>30° C. and Tgy
摘要翻译： 具有优异的撕裂，断裂，变形和扭转强度以及优异的韧性的固化性树脂组合物的固化产物，具有固化产物的印刷电路板的碱性显影型固化性树脂组合物和固化 产品被公开。 得到固化性树脂组合物，其含有（A）热塑性树脂，（B）热固性组分，（C）碱溶性组分，和（D-1）光聚合引发剂和（D-2）中的至少一种 ）光源发生器，所述热塑性树脂（A）具有两个或更多个玻璃化转变点，包括两个玻璃化转变点Tgx和Tgy，其满足Tgx> 30℃和Tgy <0℃，并且所述热固性组分（B ），其玻璃化转变点Tgz满足Tgz≥Tgy+ 20℃。此外，得到固化性树脂组合物的固化物，具有固化物的印刷电路板和固化物的制造方法。
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5.发明授权Dry film, printed wiring board using same, method for producing printed wiring board, and flip chip mounting substrate 有权干膜，使用其的印刷线路板，制造印刷线路板的方法和倒装芯片安装基板公开(公告)号：US09596754B2
公开(公告)日：2017-03-14
申请号：US14367611
申请日：2012-12-18
发明人： Gento Iwayama , Arata Endo , Shoji Minegishi , Masao Arima
IPC分类号： H05K1/00 , B32B7/02 , B32B27/38 , G06F7/00 , H01L21/00 , H05K1/03 , H01L21/56 , H05K3/28 , H01L23/498 , G03F7/40 , H05K3/00 , H05K3/46 , B32B27/08 , B32B27/16 , B32B27/20 , H05K3/34
CPC分类号： H05K1/0353 , B32B27/08 , B32B27/16 , B32B27/20 , B32B2264/102 , B32B2264/104 , B32B2307/202 , B32B2307/206 , B32B2457/08 , G03F7/40 , H01L21/563 , H01L23/49816 , H01L23/49894 , H01L2224/73204 , H01L2224/92125 , H05K1/036 , H05K1/0373 , H05K3/0082 , H05K3/281 , H05K3/3436 , H05K3/4611 , H05K2201/0195 , H05K2201/10674 , H05K2201/10977 , Y10T428/24975 , Y10T428/31515
摘要： A dry film includes a carrier film, a thermosetting resin composition layer, and a photocurable resin composition layer formed between the carrier film and the thermosetting resin composition layer. The thermosetting resin composition layer is formed by applying and drying a thermosetting resin composition. The photocurable resin composition layer is formed by applying and drying a photocurable resin composition. A method of producing a printed writing board includes forming a resin insulation layer which includes a thermosetting resin composition layer and a photocurable resin composition layer on the substrate, in the order of the thermosetting resin composition layer and the photocurable resin composition layer from a surface side of the substrate, patterning the resin insulation layer by photolithographic approach, and patterning the resin insulation layer by laser processing.
摘要翻译： 干膜包括载体膜，热固性树脂组合物层和形成在载体膜和热固性树脂组合物层之间的光固化树脂组合物层。 热固性树脂组合物层通过涂布和干燥热固性树脂组合物形成。 可光固化树脂组合物层通过涂布和干燥光固化性树脂组合物而形成。 印刷书写板的制造方法包括：以热固化性树脂组合物层和光固化性树脂组合物层的表面侧的顺序，在基板上形成树脂绝缘层，该树脂绝缘层包括热固性树脂组合物层和光固化性树脂组合物层 通过光刻法构图树脂绝缘层，并通过激光加工对树脂绝缘层进行图案化。
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6.发明授权Curable resin composition, composition for forming solder resist, dry film and printed wiring board, and laminate and process for preparing the same 有权可固化树脂组合物，用于形成阻焊剂的组合物，干膜和印刷线路板，以及其制备方法公开(公告)号：US09388308B2
公开(公告)日：2016-07-12
申请号：US14432029
申请日：2013-09-26
发明人： Daichi Okamoto , Shoji Minegishi
CPC分类号： C08L63/10 , C08J3/243 , C08J5/18 , C08J2363/00 , C08K5/3445 , C08L33/08 , C08L63/00 , C08L101/08 , H05K3/287 , Y10T428/24802 , Y10T428/31551
摘要： The present invention provides a curable resin composition that can provide a cured material excellent in insulation reliability while maintaining adhesiveness and provide a composition for forming a solder resist, a dry film and a printed wiring board, a laminate having a resin insulating layer excellent in insulation reliability while maintaining adhesiveness, a dry film for forming this and a process for preparing a laminate using the dry film. The curable resin composition contains (A) an imidazole-isocyanate adduct, (B) a carboxyl group-containing resin and (C) a thermosetting resin. The above laminate has a substrate and a plurality of resin insulating layers formed on the substrate, in which one of the plural resin insulating layers in contact with the substrate is a layer formed of the curable resin composition.
摘要翻译： 本发明提供一种固化性树脂组合物，其能够提供绝缘可靠性优异的固化物，同时保持粘合性，并提供用于形成阻焊剂，干膜和印刷线路板的组合物，具有绝缘性优异的树脂绝缘层的层压体 保持粘合性的可靠性，用于形成该干燥膜的干膜和使用干膜制备层压体的方法。 固化性树脂组合物含有（A）咪唑 - 异氰酸酯加合物，（B）含羧基树脂和（C）热固性树脂。 上述层压体具有在基板上形成的基板和多个树脂绝缘层，其中与基板接触的多个树脂绝缘层中的一个是由可固化树脂组合物形成的层。
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7.发明申请公开(公告)号：US20130256017A1
公开(公告)日：2013-10-03
申请号：US13853161
申请日：2013-03-29
发明人： Daichi OKAMOTO , Shoji Minegishi , Masao Arima
IPC分类号： H05K1/03
CPC分类号： H05K1/036 , B32B27/08 , B32B27/26 , G03F7/027 , G03F7/032 , G03F7/085 , G03F7/0955 , H05K3/285 , H05K3/287 , H05K3/3452 , H05K2201/0195 , Y10T156/10
摘要： [Problems] The present invention provides a laminated structure comprising resin insulating layers which exhibits excellent adhesion to a base material and has excellent insulation reliability; and a dry film used for the production of the laminated structure.[Means for Solution] Provided is a laminated structure comprising a base material and a plurality of resin insulating layers formed thereon, which is characterized in that a layer of the plurality of resin insulating layers, which is in contact with the base material, is a resin insulating layer (A) which contains a curing accelerator composed of an N atom-containing basic compound; and that the laminated structure comprises a resin insulating layer (B) which contains a P atom-containing curing accelerator in addition to the resin insulating layer (A) which contains a curing accelerator composed of an N atom-containing basic compound.
摘要翻译： 本发明提供一种层叠结构体，其具有对基材表现出优异的粘合性且绝缘可靠性优异的树脂绝缘层; 以及用于生产层压结构的干膜。 [解决方案]提供一种层叠结构，其包括基材和形成在其上的多个树脂绝缘层，其特征在于，与基材接触的多个树脂绝缘层的层是 树脂绝缘层（A），其含有由含N原子的碱性化合物构成的固化促进剂; 除了含有由含N原子的碱性化合物构成的固化促进剂的树脂绝缘层（A）之外，层叠结构还包含含有含P原子的固化促进剂的树脂绝缘层（B）。
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8.发明授权Pattern forming method, alkali-developable thermosetting resin composition, printed circuit board and manufacturing method thereof 有权图案形成方法，碱显影性热固性树脂组合物，印刷电路板及其制造方法公开(公告)号：US09188871B2
公开(公告)日：2015-11-17
申请号：US13896966
申请日：2013-05-17
发明人： Arata Endo , Shoji Minegishi , Masao Arima
CPC分类号： G03F7/2016 , G03F7/0045 , G03F7/038 , G03F7/0382 , G03F7/38 , H05K1/0306 , H05K3/287 , H05K3/3452
摘要： [Problem] Provided are: a pattern forming method by which a pattern can be formed by development using a thermosetting resin composition and a cured layer having excellent curability can be obtained; a thermosetting resin composition used in the pattern forming method; and a printed circuit board.[Means for Solution] The pattern forming method according to the present invention is characterized by comprising the steps of: (A) forming a resin layer composed of an alkali-developable thermosetting resin composition comprising a photobase generator on a substrate; (B) activating the photobase generator contained in the alkali-developable thermosetting resin composition by irradiation with a light in a pattern form so as to cure an irradiated part; and (C) forming a negatively patterned layer by removing a non-irradiated part by alkali development.
摘要翻译： [问题]提供：可以获得通过使用热固性树脂组合物显影图案和通过固化性优异的固化层形成图案的方法; 用于图案形成方法的热固性树脂组合物; 和印刷电路板。 [解决方案]根据本发明的图案形成方法的特征在于包括以下步骤：（A）在基材上形成由包含光碱发生剂的碱显影性热固性树脂组合物构成的树脂层; （B）通过用图案形式的光照射来活化包含在碱显影性热固性树脂组合物中的光碱发生剂，以固化照射部分; 和（C）通过碱显影除去未照射部分而形成负型图案层。
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9.发明申请CURABLE RESIN COMPOSITION, COMPOSITION FOR FORMING SOLDER RESIST, DRY FILM AND PRINTED WIRING BOARD, AND LAMINATE AND PROCESS FOR PREPARING THE SAME 有权可固化树脂组合物，形成耐火材料的组合物，干膜和印刷线路板以及其制备的层压体和方法公开(公告)号：US20150240071A1
公开(公告)日：2015-08-27
申请号：US14432029
申请日：2013-09-26
发明人： Daichi Okamoto , Shoji Minegishi
CPC分类号： C08L63/10 , C08J3/243 , C08J5/18 , C08J2363/00 , C08K5/3445 , C08L33/08 , C08L63/00 , C08L101/08 , H05K3/287 , Y10T428/24802 , Y10T428/31551
摘要： The present invention provides a curable resin composition that can provide a cured material excellent in insulation reliability while maintaining adhesiveness and provide a composition for forming a solder resist, a dry film and a printed wiring board, a laminate having a resin insulating layer excellent in insulation reliability while maintaining adhesiveness, a dry film for forming this and a process for preparing a laminate using the dry film. The curable resin composition contains (A) an imidazole-isocyanate adduct, (B) a carboxyl group-containing resin and (C) a thermosetting resin. The above laminate has a substrate and a plurality of resin insulating layers formed on the substrate, in which one of the plural resin insulating layers in contact with the substrate is a layer formed of the curable resin composition.
摘要翻译： 本发明提供一种固化性树脂组合物，其能够提供绝缘可靠性优异的固化物，同时保持粘合性，并提供用于形成阻焊剂，干膜和印刷线路板的组合物，具有绝缘性优异的树脂绝缘层的层压体 保持粘合性的可靠性，用于形成该干燥膜的干膜和使用干膜制备层压体的方法。 固化性树脂组合物含有（A）咪唑 - 异氰酸酯加合物，（B）含羧基树脂和（C）热固性树脂。 上述层叠体具有基板和形成在基板上的多个树脂绝缘层，其中与基板接触的多个树脂绝缘层中的一个是由可固化树脂组合物形成的层。
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10.发明申请DRY FILM, PRINTED WIRING BOARD USING SAME, METHOD FOR PRODUCING PRINTED WIRING BOARD, AND FLIP CHIP MOUNTING SUBSTRATE 有权干膜，使用其的印刷线路板，生产印刷线路板的方法和翻转芯片安装基板公开(公告)号：US20150016072A1
公开(公告)日：2015-01-15
申请号：US14367611
申请日：2012-12-18
发明人： Gento Iwayama , Arata Endo , Shoji Minegishi , Masao Arima
CPC分类号： H05K1/0353 , B32B27/08 , B32B27/16 , B32B27/20 , B32B2264/102 , B32B2264/104 , B32B2307/202 , B32B2307/206 , B32B2457/08 , G03F7/40 , H01L21/563 , H01L23/49816 , H01L23/49894 , H01L2224/73204 , H01L2224/92125 , H05K1/036 , H05K1/0373 , H05K3/0082 , H05K3/281 , H05K3/3436 , H05K3/4611 , H05K2201/0195 , H05K2201/10674 , H05K2201/10977 , Y10T428/24975 , Y10T428/31515
摘要： The present invention provides a dry film capable of forming a cured coating film having an excellent laser processability and a desmear resistance, and a printed writing board using the same. Further, the present invention provides a method of producing a printed writing board for a flip-chip mounting substrate capable of simply and inexpensively forming a dam preventing from spreading an underfill, a printed writing board obtained by the method of producing, and a flip-chip mounting substrate in which a chip is subjected to flip chip mounting on the printed writing board.A dry film comprising: a carrier film and a photocurable resin composition layer (L1) formed by applying and drying a photocurable resin composition; and at least a thermosetting resin composition layer (L2) formed by applying and drying a thermosetting resin composition in a gap between the photocurable resin composition layer (L1) and the carrier film. A method of producing a printed writing board comprising: a process in which a resin insulation layer which includes a thermosetting resin composition layer (L2) and a photocurable resin composition layer (L1) in order from a side of a substrate surface is formed on the substrate surface; a process to perform patterning by photolithographic approach; and a process to perform patterning by laser processing.
摘要翻译： 本发明提供能够形成具有优异的激光加工性和耐去污性的固化涂膜的干膜和使用该干膜的印刷书写板。 此外，本发明提供了一种制造用于倒装芯片安装基板的印刷书写板的方法，其能够简单且廉价地形成防止扩散底部填充物的防止堤坝，通过制造方法获得的印刷书写板， 芯片安装基板，其中芯片经过倒装芯片安装在印刷的书写板上。 1.一种干膜，其特征在于，包括：载体膜和通过涂布和干燥光固化性树脂组合物形成的光固化性树脂组合物层（L1） 和至少一种通过在光固化树脂组合物层（L1）和载体膜之间的间隙中涂覆和干燥热固性树脂组合物形成的热固性树脂组合物层（L2）。 一种印刷书写板的制造方法，其特征在于，包括以下工序：从基板表面侧开始依次形成包含热固性树脂组合物层（L2）和光固化树脂组合物层（L1）的树脂绝缘层 基材表面; 通过光刻法进行图案化的工艺; 以及通过激光加工进行图案化的工序。
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