Invention Grant
- Patent Title: Interface logic for a multi-core system-on-a-chip (SoC)
- Patent Title (中): 多核系统芯片(SoC)的接口逻辑
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Application No.: US14141574Application Date: 2013-12-27
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Publication No.: US09189439B2Publication Date: 2015-11-17
- Inventor: Ramana Rachakonda , Lance E. Hacking , Mahesh K. Reddy , Lori R. Borger , Chee Hak Teh , Pawitter P. Bhatia , John P. Lee
- Applicant: INTEL CORPORATION
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Trop, Pruner & Hu, P.C.
- Main IPC: G06F15/78
- IPC: G06F15/78 ; G06F13/40 ; G01R31/3185

Abstract:
In one embodiment, the present invention includes a system-on-a-chip (SoC) with first and second cores, interface logic coupled to the cores, chipset logic coupled to the interface logic, and a virtual firewall logic coupled between the chipset logic and the second core. The interface logic may include a firewall logic, a bus logic, and a test logic, and the chipset logic may include a memory controller to provide for communication with a memory coupled to the SoC. In some system implementations, both during test operations and functional operations, the second core can be disabled during normal operation to provide for a single core SoC, enabling greater flexibility of use of the SoC in many different implementations. Other embodiments are described and claimed.
Public/Granted literature
- US20140108695A1 INTERFACE LOGIC FOR A MULTI-CORE SYSTEM-ON-A-CHIP (SOC) Public/Granted day:2014-04-17
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