Invention Grant
- Patent Title: Data interleaving module
- Patent Title (中): 数据交错模块
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Application No.: US14330076Application Date: 2014-07-14
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Publication No.: US09189440B2Publication Date: 2015-11-17
- Inventor: Luigi Pilolli , Maria-Luisa Gallese , Mauro Castelli
- Applicant: Micron Technology, Inc.
- Applicant Address: US ID Boise
- Assignee: Micron Technology, Inc.
- Current Assignee: Micron Technology, Inc.
- Current Assignee Address: US ID Boise
- Agency: Brooks, Cameron & Huebsch, PLLC
- Main IPC: G11C7/10
- IPC: G11C7/10 ; G06F13/40 ; G06F12/06 ; G11C11/56
Abstract:
The present disclosure includes apparatuses and methods related to a data interleaving module. A number of methods can include interleaving data received from a bus among modules according to a selected one of a plurality of data densities per memory cell supported by an apparatus and transferring the interleaved data from the modules to a register.
Public/Granted literature
- US20150019787A1 DATA INTERLEAVING MODULE Public/Granted day:2015-01-15
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