发明授权
- 专利标题: Electrode coating for electron emission devices within cavities
- 专利标题(中): 腔内电子发射器件的电极涂层
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申请号: US14261246申请日: 2014-04-24
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公开(公告)号: US09190237B1公开(公告)日: 2015-11-17
- 发明人: Klaus Reimann , Olaf Wunnicke , Michael in 't Zandt
- 申请人: NXP B.V.
- 申请人地址: NL Eindhoven
- 专利权人: NXP B.V.
- 当前专利权人: NXP B.V.
- 当前专利权人地址: NL Eindhoven
- 主分类号: H01J9/00
- IPC分类号: H01J9/00 ; H01J9/12 ; H01J9/02 ; H01L27/02
摘要:
Embodiments of a method for forming a field emission diode for an electrostatic discharge device include forming a first electrode, a sacrificial layer, and a second electrode. The sacrificial layer separates the first and second electrodes. The method further includes forming a cavity between the first and second electrode by removing the sacrificial layer. The cavity separates the first and second electrodes. The method further includes depositing an electron emission material on at least one of the first and second electrodes through at least one access hole after formation of the first and second electrodes. The access hole is located remotely from a location of electron emission on the first and second electrode.