Invention Grant
- Patent Title: Pattern forming method
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Application No.: US14550637Application Date: 2014-11-21
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Publication No.: US09190288B2Publication Date: 2015-11-17
- Inventor: Hiroki Tanaka , Ryosuke Yamamoto , Naoko Kihara
- Applicant: Hiroki Tanaka , Ryosuke Yamamoto , Naoko Kihara
- Applicant Address: JP Tokyo
- Assignee: KABUSHIKI KAISHA TOSHIBA
- Current Assignee: KABUSHIKI KAISHA TOSHIBA
- Current Assignee Address: JP Tokyo
- Agency: Nixon & Vanderhye P.C.
- Main IPC: H01L21/302
- IPC: H01L21/302 ; H01L21/461 ; C03C15/00 ; C03C25/68 ; B44C1/22 ; C08F2/00 ; C08F4/00 ; H01L21/308 ; B82Y10/00 ; G11B5/74 ; G11B5/82 ; G11B5/855 ; B81C1/00 ; H01L21/027 ; H01L21/306
Abstract:
A pattern forming method includes forming a coating film containing a hydrophilic first homopolymer having a first bonding group and a hydrophobic second homopolymer having a second bonding group capable of bonding with the first bonding group, forming a bond between the first and second bonding group to produce a block copolymer of the first and second homopolymers, and heating the coating film to microphase-separating the copolymer into a hydrophilic domain and a hydrophobic domain. The hydrophilic and hydrophobic domains are arranged alternately. The bond is broken, then selectively dissolving-removing either domain by a solvent to provide a polymer pattern of a remainder domain.
Public/Granted literature
- US20150079794A1 PATTERN FORMING METHOD Public/Granted day:2015-03-19
Information query
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